Analog & Chiptop Design Engineer

Sony Depthsensing Solutions; Brussel Hoofdstad; Sur place; EUR 85 000 - 120 000; Plein temps

Résumé du poste

Sony Depthsensing Solutions in Brussels seeks an experienced Analog Chiptop Design Engineer to drive top‑level sensor designs for next‑generation image sensors. You will collaborate with analog, logic and pixel teams to deliver robust chiptop solutions that enable first silicon success.

Responsibilities include chiptop productization, IO pads and ESD, power and clock distribution, and tight interaction with design, back‑end, device and packaging teams.

Qualifications

• Master’s degree in electrical engineering or equivalent.
• 5+ years in analog/chiptop design with responsibilities as described above.
• Background in analog design engineering with layout at top level of chips with recent nodes.
• Strong communications skills and ability to work with multiple design teams.

Responsabilités

• You will work on productization of sensors: chiptop level design with physical, electrical and optical considerations.
• You will perform full-cycle follow-up from conception to design to verifications.
• You implement the TOP level of the sensor (IO pads, ESD IO body, wafer connectivity) with daily interaction with design teams.
• You are responsible for ESD protection of the sensor and support mask improvement after tape-out.
• You are the interface among the Design environment, the Device and the Design team.

Connaissances

English proficiency

Top-level chiptop design

Layout design at top level

Communication skills

Unix scripting (SKILL/Ocean)

Collaborative teamwork

Travel willingness

Formation

Master’s degree in electrical engineering or equivalent

Outils

Cadence Virtuoso

Assura

Calibre

Synopsys StarRC

Cadence QRC

Description du poste

We are looking for a Analog Chiptop Design Engineer to work on next generation sensor designs and architectures in our Brussels location.

This position is part of an advanced technology team which is enabling the next generation of image sensors.

The successful candidate will bring their deep knowledge and proven experience in sensor design to yield the highest quality of first silicon success. Your main focus will be on the top level design of SDS sensors.

Responsibilities

• You will work on productization of sensors: This will include chiptop level design of the sensor with considerations to physical requirements (chip size, block/pad locations), electrical requirement (power/clock distribution, ESD, noise), and optical requirements.
• You will perform full-cycle follow-up from conception to design to verifications.
• You implement the TOP level of the sensor (IO pads, ESD IO body, connectivity of stacked wafers) based on the daily interaction with design teams (analog, logic, pixel) and optimize based on the feedback from Implementation/Back-end, Package and Device teams.
• You are responsible for the ESD protection of the sensor and support the mask improvement after the tape out.
• You are the interface among the Design environment, the Device and the Design team.

Qualifications

• You have a strong command of English.
• You have a master’s degree in electrical engineering or similar by experience.
• You have more than 5 years’ experience in the analog/chiptop design domain with responsibilities as described above.
• You have a background in analog design engineering with proven experience on layout design at top level of chips with recent technology nodes.
• You will require an analytical mind with a strong commitment to quality and high team spirit and social skills as you will be working with design teams, and hardware and software engineers to successfully complete challenging IC and sensor system design projects.
• This position requires strong communications skills: Ability to communicate and work efficiently with various IC design teams (analog, logic, pixel, verification etc.) is very important.
• You are familiar with the design of complex analog blocks such as ADC, DAC, PLL, bias generator, gain amplifiers, and comparators. Knowledge of image sensor functions a plus.
• You are experienced in Cadence Virtuoso schematic. Know-how on layout is a mandatory.
• You are experienced in implementing protection circuits for ESD tests and requirements (HBM, CDM).
• You understand the concepts of power analysis, clock distribution, IR drop measurement.
• You have knowledge in wafer, package and assembly process (for example Hot carrier light blocking, Plasma-induced damage, band noise, mask improvement support…).
• You have experience with LVS / DRC at block and full chip level using tools like Assura and Calibre.
• You are familiar with full physical verification flow and tools.
• You are familiar with parasitic extraction using tools like Cadence QRC, Synopsys StarRC.
• Ability to write script in Unix, SKILL or Ocean is a plus.
• You have knowledge of simulation analysis of analog blocks including a deep understanding of basic (R/L/C/Tr) element fabrication process, simulation models and model accuracy.
• You are goal oriented and have an innovative approach to problem solving.
• You are willing to travel internationally if needed.
• Japanese language skills are a strong advantage.
• Planning skills are also needed for this position.
• Strong commitment is necessary, especially close to the release milestone.