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Imec invites applications for a Master/PhD internship focused on Machine Learning-Based Defect Classification and Anomaly Detection in advanced IC package 3D interconnects using Scanning Acoustic Microscopy. The project aims to automate failure analysis and improve reliability in 3D IC interconnects through data-efficient ML methods.
The role requires strong programming in Python (or MATLAB) and experience with ML frameworks (PyTorch, scikit-learn).
Imec invites applications for a Master/PhD internship focused on Machine Learning-Based Defect Classification and Anomaly Detection in advanced IC package 3D interconnects using Scanning Acoustic Microscopy. The project aims to automate failure analysis and improve reliability in 3D IC interconnects through data-efficient ML methods.
The role requires strong programming in Python (or MATLAB) and experience with ML frameworks (PyTorch, scikit-learn).