Staff Engineer - 3D Integration (d/m/f)

ams OSRAM; Premstätten; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Benefits dieser Stelle

Competitive salary

Zusammenfassung

ams OSRAM is seeking a highly skilled engineer to develop manufacturing process modules and lead teams in the area of advanced 3D integration. The role requires ownership of projects from concept through implementation, with a strong emphasis on documentation, quality, and timely execution.

Candidates should hold a Master’s or PhD in Physics, Chemistry, or a related discipline, have deep TSV experience, and be proficient in English.

Qualifikationen

• Advanced university degree in Physics, Chemistry, or related field.
• Strong understanding of TSVs with focus on development and industrialization of process modules.
• Experience with Wafer-to-Wafer bonding and Die-to-Wafer stacking for 3D/heterogeneous integration concepts.

Aufgaben

• Develop manufacturing process modules from concept to implementation.
• Lead sub-teams within larger projects and own work packages.
• Define, implement, analyze and document experiments.
• Apply risk assessment techniques (e.g., FMEA) and mitigate risks during development.

Kenntnisse

TSV knowledge

3D integration

Wafer-to-Wafer bonding

Die-to-Wafer stacking

Project leadership

English proficiency

Data-driven reporting

Ausbildung

Master’s or PhD in Physics, Chemistry, or related

Jobbeschreibung

Responsibilities

• Develop manufacturing process modules in collaboration with internal and external Fabs, from concept design through implementation
• Take ownership of projects or work packages depending on the project size and complexity and lead sub-teams within larger projects
• Definition, implementation, analysis and documentation of experiments
• Solve problems during process development and take technical decisions within projects
• Collaborate in a team-oriented environment with a strong emphasis on quality, timely project execution and documentation
• Lead the characterization of material/technologies during development and compile comprehensive, data-driven reports
• Apply structured risk assessment techniques (e.g.: FMEA) and mitigate/minimize risks during development to ensure successful project completion and a seamless handover to production
• Propose innovative process and device concepts, contributing to the company’s intellectual property portfolio through patent submissions
• Advanced university degree (Master’s or PhD) in Physics, Chemistry, or a related scientific or engineering discipline
• Strong understanding of Through Silicon Vias (TSVs) with a focus on the development, integration and industrialization of process modules
• Experience with Wafer-to-Wafer bonding and Die-to-Wafer stacking as basis for the development of 3D and heterogeneous integration concepts
• Proven team player with excellent collaboration skills
• Proficient in English, both written and spoken, with a clear and structured reporting style

Job description

• Develop manufacturing process modules in collaboration with internal and external Fabs, from concept design through implementation
• Take ownership of projects or work packages depending on the project size and complexity and lead sub-teams within larger projects
• Definition, implementation, analysis and documentation of experiments
• Solve problems during process development and take technical decisions within projects
• Collaborate in a team-oriented environment with a strong emphasis on quality, timely project execution and documentation
• Lead the characterization of material/technologies during development and compile comprehensive, data-driven reports
• Apply structured risk assessment techniques (e.g.: FMEA) and mitigate/minimize risks during development to ensure successful project completion and a seamless handover to production
• Propose innovative process and device concepts, contributing to the company’s intellectual property portfolio through patent submissions

Profile description

• Advanced university degree (Master’s or PhD) in Physics, Chemistry, or a related scientific or engineering discipline
• Strong understanding of Through Silicon Vias (TSVs) with a focus on the development, integration and industrialization of process modules
• Experience with Wafer-to-Wafer bonding and Die-to-Wafer stacking as basis for the development of 3D and heterogeneous integration concepts
• Proven team player with excellent collaboration skills
• Proficient in English, both written and spoken, with a clear and structured reporting style

We offer

We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).

We offer a higher compensation depending on your expertise and skills.

Find out more about us at: www.ams-osram.com