Lead Build-Up Process Engineer for Glass Core Substrates

Mental Health Group; Österreich; Remote; EUR 110.000 - 140.000; Vollzeit

Benefits dieser Stelle

Long-term growth

Onboarding program

Modern canteen

Free parking & charging

Health benefits

Diversity & inclusion

Zusammenfassung

AT&S Leoben is seeking a Principal Engineer R&D - Build-up Process to drive next-generation Glass Core Substrate technologies. You will lead development, optimize processes, and shape roadmaps with internal and external partners to industrialize high-performance packaging solutions.

Candidates have 10+ years in substrate or semiconductor packaging, strong expertise in dielectrics, vias, metallisation, lithography, and reliability, plus excellent leadership and English communication.

Qualifikationen

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electronics Engineering, or a related field.
• 10+ years of experience in substrate, PCB, semiconductor packaging, or related process technology development.
• Strong expertise in build-up process technologies including dielectric lamination, via formation, metallisation, lithography, etching, and plating.
• Experience in process integration and technology development for high-density interconnect and advanced substrate applications.
• Knowledge of glass handling, temporary carrier/support systems, thin substrate processing, and defect control methodologies.
• Strong understanding of electrical and thermo-mechanical reliability requirements for advanced substrate technologies.
• Experience in process optimisation, yield improvement, root cause analysis, and reliability enhancement.
• Proven ability to lead complex technical projects and drive cross-functional collaboration.
• Strong communication and problem-solving skills with the ability to influence technical direction and development strategy.
• Fluency in English

Aufgaben

• Lead development of build-up technologies for Glass Core Substrate applications.
• Develop and optimize process technologies including glass handling, temporary support systems, dielectric lamination, via formation, metallisation, lithography, etching, and plating.
• Establish integration strategies to meet electrical performance, reliability, yield, and manufacturability.
• Define technology roadmaps for build-up structures, fine‑line interconnects, and next‑generation Glass Core Substrate architectures.
• Develop handling concepts to minimise glass damage, warpage, cracking, and defects.
• Drive root cause analysis and corrective actions for process and reliability issues.
• Collaborate with material suppliers, equipment vendors, and cross‑functional teams to accelerate technology development and qualifications.
• Provide technical leadership for development programmes, intellectual property generation, and technology transfer activities.

Kenntnisse

Leadership

Communication

Problem-solving

Fluency in English

Ausbildung

Bachelor's or Master's in Materials Science/Engineering

Jobbeschreibung

AT&S Leoben is seeking a Principal Engineer R&D - Build-up Process to drive next-generation Glass Core Substrate technologies. You will lead development, optimize processes, and shape roadmaps with internal and external partners to industrialize high-performance packaging solutions.

Candidates have 10+ years in substrate or semiconductor packaging, strong expertise in dielectrics, vias, metallisation, lithography, and reliability, plus excellent leadership and English communication.