R&D Glass Core Packaging Engineer – Reliability & Innovation

Mental Health Group; Österreich; Remote; EUR 70.000 - 95.000; Vollzeit

Benefits dieser Stelle

Structured onboarding program

On‑site modern canteen with meals

Free parking spaces and e-charging

Diverse employee benefits

Zusammenfassung

AT&S in Leoben, Austria, is seeking an Engineer R&D - Product and Process Reliability to drive the development and reliability of next-generation glass core substrate technologies, collaborating with suppliers and cross-functional teams to design and qualify packaging solutions for advanced semiconductor applications.

You will run reliability test plans, oversee TGV structure and coating configuration, and analyze failure modes such as cracking and CTE-mismatch, ensuring robust product

Qualifikationen

• Bachelor’s or Master’s in materials science, mechanical engineering, electronics packaging, or related field.
• 3+ years of experience in reliability engineering, materials reliability, or packaging/substrate technology development.
• Expertise in thermo-mechanical reliability and failure mode analysis.
• Familiarity with JEDEC/IPC standards; stress simulation is a plus.

Aufgaben

• Develop a defect-free process for glass core substrate working with materials suppliers.
• Lead reliability design, evaluation, and qualification of glass core substrate (TGV, coating).
• Execute reliability test plans covering thermal cycling, mechanical stress, warpage, and electrical stability.
• Analyze failure mechanisms (TGV cracking, SeWaRe, CTE-mismatch) and propose improvements.
• Manage cross-functional tasks and technical documentation.
• Analyze data to improve product performance and process efficiency.

Kenntnisse

Fluency in English

Thermo-mechanical reliability

Failure mode analysis

Cross-functional collaboration

Ausbildung

Bachelor’s/Master’s in materials science, mechanical engineering, electronics packaging

Tools

Stress simulation

JEDEC/IPC standards

Jobbeschreibung

AT&S in Leoben, Austria, is seeking an Engineer R&D - Product and Process Reliability to drive the development and reliability of next-generation glass core substrate technologies, collaborating with suppliers and cross-functional teams to design and qualify packaging solutions for advanced semiconductor applications.

You will run reliability test plans, oversee TGV structure and coating configuration, and analyze failure modes such as cracking and CTE-mismatch, ensuring robust product