Low-Power Wireless SoC Architect

EM Microelectronic; Schweiz; Vor Ort; EUR 193.339 - 257.786; Vollzeit

Zusammenfassung

EM Microelectronic, located in Switzerland, seeks a Principal Wireless SoC Architect to define end-to-end architecture for next-generation low-power wireless SoCs. You will lead cross-functional teams across RF, analog, digital, and software, driving system-level optimization from concept to production.

The role requires MSc/PhD in Electrical or Computer Engineering with 15+ years in wireless SoC/RF CMOS design and a proven track record in bringing low-power RF SoCs to production.

Qualifikationen

• MSc or PhD in Electrical or Computer Engineering or equivalent.
• 15+ years of experience in wireless SoC/RF CMOS design.
• Proven track record bringing low-power RF SoCs to production.
• Strong expertise in wireless architectures, system design, and RF integration.

Aufgaben

• Define end-to-end SoC architecture and system partitioning.
• Lead cross-functional technical alignment across RF, analog, digital, and software domains.
• Drive system-level optimization including power, performance, and cost.
• Oversee SoC integration including package and PCB considerations.
• Contribute to product roadmap, competitive benchmarking, and technology strategy.
• Support development lifecycle from requirements through validation and qualification.

Kenntnisse

Strong communication

Cross-functional leadership

Structured problem solving

Ownership mindset

Multicultural environments

Bluetooth LE

Ausbildung

MSc/PhD in Electrical or Computer Engineering

Tools

22nm node

Jobbeschreibung

Location : Rue des Sors 3, 2074 Marin, Switzerland (Neuchatel)

The Principal Wireless SoC Architect defines and drives the architecture of our next-generation low-power wireless SoCs, ensuring optimal system performance from concept to production. The role combines deep technical expertise with strong cross-functional leadership across global teams.

You get the opportunity to define next-generation wireless SoC platforms and work with global teams on innovative semiconductor solutions in high-growth markets.

Key Responsibilities

• Define end-to-end SoC architecture and system partitioning
• Lead cross-functional technical alignment across RF, analog, digital, and software domains
• Drive system-level optimization including power, performance, and cost
• Oversee SoC integration including package and PCB considerations
• Contribute to product roadmap, competitive benchmarking, and technology strategy
• Support development lifecycle from requirements through validation and qualification
• Communicate architectural decisions clearly to stakeholders

Profile

• Strong communication and cross-functional leadership
• Ability to influence technical decisions at system level
• Structured problem-solving and trade-off analysis
• High motivation and ownership mindset
• Ability to work in multicultural environments

Professional requirements

Required Qualifications

• MSc/PhD in Electrical or Computer Engineering
• 15+ years experience in wireless SoC / RF CMOS design
• Proven track record bringing low-power RF SoCs to production
• Strong expertise in wireless architectures, system design, and RF integration

Preferred Qualifications

• Experience with Bluetooth LE or similar protocols
• Knowledge of advanced nodes (≤22nm) and ultra-low voltage design
• Experience with automotive or medical standards

Languages

• Fluent in English, French would be a great asset