Yield Tech Equipment Intern AI-Driven Process Optimization

Micron Technology

Boise (ID)

On-site

USD 25,000 - 39,000

Part time

14 days+

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Job summary

Micron Technology is seeking a Yield Technology Equipment Engineer Intern for the Boise, ID area. You will learn about optical, x-ray, profile, and eBeam inspection tools used in next-generation memory solutions and help develop new solutions to improve tool performance and efficiency.

The role offers collaboration with process control, data science, yield analysis, and metrology teams, with emphasis on problem-solving, in-line signals, and creative improvements in a semiconductor defect

Qualifications

  • Pursuing a Bachelor's or Master's degree in Electrical, Chemical, or Materials Science & Engineering or related field; must be current student and not graduate before Sept 2027.
  • Internship designed to develop critical thinking and problem-solving while analyzing process anomalies and correlations.
  • Experience or interest in AI tools and metrology for defect analysis and process control.

Responsibilities

  • Review experimental process flows for defect anomalies and quarantining tools out of control.
  • Identify and raise awareness of process anomalies and drive improvement today.
  • Use inline process signals to drive process improvements.
  • Apply understanding of AI agents, Claude Code, LLMs to enhance efficiency.
  • Collaborate with process control, data science, yield analysis, and metrology teams.
  • Develop techniques to identify relevant process issues and improve measurement strategies.

Skills

Creative problem solving
Data manipulation
Analytical skills
Excellent communication

Education

Bachelor’s or Master’s in Electrical Engineering
Bachelor’s or Master’s in Chemical Engineering
Bachelor’s or Master’s in Materials Science & Engineering

Tools

Scanning Electron Microscope
Focused Ion Beam tools

Job description

Micron Technology is seeking a Yield Technology Equipment Engineer Intern for the Boise, ID area. You will learn about optical, x-ray, profile, and eBeam inspection tools used in next-generation memory solutions and help develop new solutions to improve tool performance and efficiency.

The role offers collaboration with process control, data science, yield analysis, and metrology teams, with emphasis on problem-solving, in-line signals, and creative improvements in a semiconductor defect

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