Wireless Chip Architect

Hillcrest Labs, acquired by CEVA; California (MO); On-site; USD 140,000 - 210,000; Full time

Job summary

Ceva is seeking a Wireless Architect to drive the definition of connectivity subsystem architectures for next-generation products including Wi‑Fi, Bluetooth and UWB. You will lead technical pre-sales, co-develop joint offerings with customers, and bring a creative, flexible mindset to solving complex connectivity challenges from concept through production.

The role requires deep architectural depth and product engineering experience across full lifecycle, including post tape-out testing, silicon

Qualifications

• Deep understanding of full-system SoC architecture and connectivity subsystems.
• Experience in post tape-out testing, silicon bring-up, production.
• Experience in wireless communications systems design.
• Knowledge of wireless standards (WiFi, BT, UWB).
• Proven tape-outs and production-ready ASIC experience.
• Strong technical leadership and customer-facing ability.
• Ability to translate customer feedback into architectural requirements.

Responsibilities

• Drive full-system view of connectivity within an SoC, including CPU, memory, and peripherals.
• Define connectivity subsystem architecture specs, PMU targets, and interfaces.
• Lead technical discussions with customers and present architecture options.
• Co-develop joint solutions with customers and partners during system integration.
• Support product lifecycle, production-readiness, and silicon characterization.
• Collaborate with design, firmware, validation, and product management.

Skills

SoC architecture

Product engineering

Wireless systems

Wireless standards

ASIC design

VLSI development

Technical leadership

Communication skills

Customer facing

Creative problem solving

Education

B.Sc. or M.Sc in Electrical Engineering

Job description

About the Business Unit:

Ceva is at the forefront of the Smart Edge revolution, with innovative state-of-the-art Silicon and Software solutions that enable products to Connect, Sense and Infer. Our advanced wireless technologies, including Bluetooth, Wi-Fi, UWB, and Cellular IoT, are integrated into over a Billion devices annually. We are offering you a unique opportunity to shape and make a great impact on the roadmap of connected devices.

About The Role

In this role, you will be at the intersection of cutting-edge wireless technology and direct customer engagement. As a Wireless Architect, you drive the definition of connectivity subsystem architectures for next-generation products including Wi-Fi, Bluetooth, and UWB with mixed analog/digital hardware. You will also serve as a key technical partner for our customers, leading technical pre-sales, co-develop joint solution offerings, and bring a creative, flexible mindset to solving complex real-world connectivity challenges. This requires both architectural depth and strong product engineering experience, from concept through productization.

Responsibilities

Drive full-system view of how the connectivity subsystem interacts within an SoC, including CPU/processor, memory, and peripheral interfaces

Definition Of Connectivity Subsystem Architecture Specifications Including

• Feature-set definition and PPA (Power, Performance, Area) targets
• Definition of system low power modes and PMU requirements
• Definition of HW and SW interfaces of the connectivity sub-systems including: HW interfaces, state machines, operation sequences etc…
• Analog and digital domains partitioning

Customer facing and technical engagement

• Lead technical discussions with customers, presenting connectivity architecture options and value propositions
• Co-develop joint solution offerings with customers and partners, acting as technical advisor during system integration phases

Support product lifecycle and productization

• Support post-tape-out testing, production validation, and productization of wireless connectivity solutions
• Lead or contribute to production-readiness activities including silicon characterization, yield analysis, and qualification testing

Cross-functional leadership

• Work closely with logic design, physical design, firmware, and validation teams to ensure successful implementation
• Support wireless subsystem integration process from architectural definition through implementation, lab integration and test coverage planning
• Collaborate with product management and business development stakeholders to translate customer feedback into architectural requirements and product roadmap inputs

Requirements

• B.Sc. or M.Sc in Electrical Engineering
• Deep understanding of full-system SoC architecture, with emphasis on how connectivity subsystems interact with processors, memory controllers, power domains, and software stacks
• Product engineering experience: deep understanding of full lifecycle including post tape-out testing, silicon bring-up, productization, and production qualification.
• Experience in system definition for wireless communication systems
• Experience in wireless communication standards (such as WiFi/BT/Cellular/UWB)
• Experience in ASIC design and architecture, with proven experience in successful tape-outs and production
• Knowledge in performance and power modeling and analysis
• Deep understanding of VLSI development process and methods
• Technical leadership
• Strong communicator, able to translate complex architectural concepts for customers, executives, and engineering teams.
• Creative and flexible mindset: comfortable navigating ambiguous requirements and proposing pragmatic, innovative solutions
• Proven customer facing experience. Leading technical discussion, building trust, and influencing design decisions.

Advantages

• Knowledge in RF integration and performance optimization
• Previous experience with 3rd party IP integration
• Knowledge in CPU/Processor architecture