Customer-Facing Wireless Subsystem Architect

Hillcrest Labs, acquired by CEVA; California (MO); On-site; USD 140,000 - 210,000; Full time

Job summary

Ceva is seeking a Wireless Architect to drive the definition of connectivity subsystem architectures for next-generation products including Wi‑Fi, Bluetooth and UWB. You will lead technical pre-sales, co-develop joint offerings with customers, and bring a creative, flexible mindset to solving complex connectivity challenges from concept through production.

The role requires deep architectural depth and product engineering experience across full lifecycle, including post tape-out testing, silicon

Qualifications

• Deep understanding of full-system SoC architecture and connectivity subsystems.
• Experience in post tape-out testing, silicon bring-up, production.
• Experience in wireless communications systems design.
• Knowledge of wireless standards (WiFi, BT, UWB).
• Proven tape-outs and production-ready ASIC experience.
• Strong technical leadership and customer-facing ability.
• Ability to translate customer feedback into architectural requirements.

Responsibilities

• Drive full-system view of connectivity within an SoC, including CPU, memory, and peripherals.
• Define connectivity subsystem architecture specs, PMU targets, and interfaces.
• Lead technical discussions with customers and present architecture options.
• Co-develop joint solutions with customers and partners during system integration.
• Support product lifecycle, production-readiness, and silicon characterization.
• Collaborate with design, firmware, validation, and product management.

Skills

SoC architecture

Product engineering

Wireless systems

Wireless standards

ASIC design

VLSI development

Technical leadership

Communication skills

Customer facing

Creative problem solving

Education

B.Sc. or M.Sc in Electrical Engineering

Job description

Ceva is seeking a Wireless Architect to drive the definition of connectivity subsystem architectures for next-generation products including Wi‑Fi, Bluetooth and UWB. You will lead technical pre-sales, co-develop joint offerings with customers, and bring a creative, flexible mindset to solving complex connectivity challenges from concept through production.

The role requires deep architectural depth and product engineering experience across full lifecycle, including post tape-out testing, silicon