Wet Process Equipment Intern — Semiconductors

1000 Micron Technology, Inc.

Boise (ID)

On-site

USD 25,000 - 36,000

Full time

8 days ago

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Benefits offered by this job

Medical, dental, vision plans
Paid holidays
Paid time off
Benefits guide

Job summary

Micron Technology offers an internship in the Wet Process Equipment Development Engineering group. You will gain hands-on experience designing, maturing, and optimizing wet process equipment for Micron's memory parts while applying AI to improve efficiency.

The role emphasizes problem solving, data analysis, teamwork, and presenting findings. Expected progress toward a degree (B.S./M.S./Ph.D.) in engineering, with graduation after Sept 2027.

Qualifications

  • Pursuing a degree in engineering or related science field; expected to graduate after September 2027.
  • Willingness to learn and apply AI-driven approaches in daily tasks.
  • Interest in semiconductor wet process hardware and equipment development.

Responsibilities

  • Adopt a Safety First mindset in day-to-day activities.
  • Present and articulate work to teammates and stakeholders.
  • Conduct experiments to understand equipment capabilities and limitations.
  • Develop in-process hardware and analytical techniques for wet process systems.
  • Perform statistical data analysis to validate equipment performance.
  • Solve complex engineering problems related to Wet Process hardware.

Skills

Engineering problem solving
AI proficiency
Data analysis
Team collaboration
Statistical analysis
Curiosity/initiative

Education

B.S., M.S., or Ph.D. in Engineering or related field

Job description

Micron Technology offers an internship in the Wet Process Equipment Development Engineering group. You will gain hands-on experience designing, maturing, and optimizing wet process equipment for Micron's memory parts while applying AI to improve efficiency.

The role emphasizes problem solving, data analysis, teamwork, and presenting findings. Expected progress toward a degree (B.S./M.S./Ph.D.) in engineering, with graduation after Sept 2027.

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