Wet Etching Group Lead – TGV & Copper Processes

3D Glass Solutions, Inc-; Albuquerque (NM); On-site; USD 120,000 - 160,000; Full time

Job summary

3D Glass Solutions, Inc- is seeking a Group Leader – Wet Etching (TGV & Cu) to drive development, optimization, and manufacturing support for wet etching in glass panel semiconductor manufacturing. You will lead process qualification, DOE, and cross-functional teams to achieve robust profiles, high yield, and process stability.

The role requires 8–12 years in semiconductor wet etching or related fields; relocation to Albuquerque, NM for 1–2 years, with possible assignment to India; strong

Qualifications

• Engineering degree in chemical-related field.
• 8–12 years of experience in semiconductor wet etching or related technologies.
• Willing to relocate to Albuquerque, NM for 1–2 years; possible relocation to India or Bhubaneswar for 2 years or permanently.

Responsibilities

• Lead development and optimization of wet etching for TGV formation and copper patterning.
• Mentor and guide process engineers and technicians; drive process excellence and learning.
• Define and control critical process parameters (etch chemistry, temp, spray pressure, conveyor speed).
• Own and improve wet etching process performance (profile control, surface quality, defect reduction).
• Lead root cause analysis and corrective actions for defects (undercut, over-etch, residue).
• Drive process qualification, DOE, characterization, and recipe optimization for new tools and chemistries.
• Collaborate with cleaning, lithography, plating, and wet chemistry teams for compatibility and stability.
• Support pilot line and high-volume manufacturing ramp with yield and throughput improvements.
• Own equipment qualification activities (SAT, IQ/OQ/PQ, production release).

Skills

Etch chemistry

Process integration

DOE & FMEA

Leadership/mentoring

Education

Chemical Engineering degree

Materials Science/Chemistry/Metallurgy degree

Tools

SPC

DOE

FMEA

Process troubleshooting

Job description

3D Glass Solutions, Inc- is seeking a Group Leader – Wet Etching (TGV & Cu) to drive development, optimization, and manufacturing support for wet etching in glass panel semiconductor manufacturing. You will lead process qualification, DOE, and cross-functional teams to achieve robust profiles, high yield, and process stability.

The role requires 8–12 years in semiconductor wet etching or related fields; relocation to Albuquerque, NM for 1–2 years, with possible assignment to India; strong