Wet Etch Process Technician – High-Volume Semiconductors

Samsung Semiconductor; Taylor (TX); On-site; USD 39,000 - 126,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Life insurance

401(k) matching

Onsite café

Workout facilities

Paid parental leave

Paid time off

Job summary

Samsung Austin Semiconductor seeks a Process Technician for the Cleans department (Wet Etch) to support high‑volume manufacturing of advanced semiconductor devices. You will respond to product quality issues, perform equipment qualification, misprocess disposition, root cause investigation, and manage the production line.

The role requires 2+ years of technician experience, familiarity with Cu electroplating processes on DNS/SEMES/TEL/FSI platforms, and proficiency with Microsoft Office.

Qualifications

• 2+ years of experience as a Process Technician or MFG specialist or equivalent semiconductor experience.
• Experience with cleans and Cu electroplating processes is preferred (DNS, SEMES, TEL or FSI platforms).
• Experience analyzing SPC charts and trend charts is a plus.

Responsibilities

• Set up qualification plans to monitor wafer quality after tool maintenance.
• Respond to SPC interlocks after root cause investigation.
• Determine and execute plans for wafers involved in tool faults, possibly modifying recipes to complete Wet Etch process.
• Investigate manufacturing constraints related to tool availability and product movement.

Skills

Process Technician experience

SPC analysis

Microsoft Office

Education

Associate degree

Tools

DNS platform

SEMES platform

TEL platform

FSI platform

Job description

Samsung Austin Semiconductor seeks a Process Technician for the Cleans department (Wet Etch) to support high‑volume manufacturing of advanced semiconductor devices. You will respond to product quality issues, perform equipment qualification, misprocess disposition, root cause investigation, and manage the production line.

The role requires 2+ years of technician experience, familiarity with Cu electroplating processes on DNS/SEMES/TEL/FSI platforms, and proficiency with Microsoft Office.