Wafer Cleaving Process Engineer - Edge Laser Ops

Lumentum Operations LLC; Greensboro (NC); On-site; USD 90,000 - 166,000; Full time

Job summary

Lumentum is seeking an experienced Process Engineer to lead the processing of singulation and facet preparation for edge emitting laser components. You will sustain existing processes and develop new methods for emerging technologies, working from wafer singulation to facet coating preparation with a focus on process control and quality.

You will analyze yield, defects, and reliability issues using JMP/Excel/SQL/Python, drive continuous improvements, and collaborate with cross-functional teams

Qualifications

• B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering or related discipline.
• 5+ years of industrial experience supporting semiconductor or advanced manufacturing processes.

Responsibilities

• Wafer singulation: Process development for wafer cleaving operation.
• Own and sustain processing of thinned wafers through the singulation and facet coating preparation.
• Establish and maintain processes, specifications, SPC controls, FMEAs and OCAPs.
• Facet Processing: Develop and sustain pick and place processes and equipment.
• Develop and sustain bar stacking/unstacking to and from fixtures for facet processing.
• Manufacturing Support & Yield Improvement: Provide real-time engineering support for thinning operations in high-volume manufacturing.
• Lead response to process excursions, tool issues, and product at-risk situations using structured problem-solving methods.
• Investigate yield losses, defects, and reliability issues and implement corrective and preventative actions.

Skills

Semiconductor process engineering

Process development

SPC/DOE/statistical analysis

Problem solving

Effective communication

Data tools experience

Education

Bachelor's or Master's degree in Materials Science, Mechanical, Electrical or related

Tools

JMP

Excel

SQL

Python

Job description

Lumentum is seeking an experienced Process Engineer to lead the processing of singulation and facet preparation for edge emitting laser components. You will sustain existing processes and develop new methods for emerging technologies, working from wafer singulation to facet coating preparation with a focus on process control and quality.

You will analyze yield, defects, and reliability issues using JMP/Excel/SQL/Python, drive continuous improvements, and collaborate with cross-functional teams