Vice President of Engineering

Teksky LLC; California (MO); On-site; USD 260,000 - 380,000; Full time

Job summary

Teksky LLC seeks a high-impact VP of HW Systems Engineering to lead the hardware organization from concept to high-volume production for TCU products. You will own the hardware lifecycle, remain hands-on in design and debugging, and drive secure server infrastructure initiatives while navigating supplier constraints.

You will manage senior engineers and contractors, push for OCP-aligned hardware solutions, and champion open hardware ecosystems in partnership with customers and partners.

Qualifications

• 20+ years hardware engineering experience, leadership in servers/data center/semiconductor ecosystems.
• Deep hands-on mastery in circuit design, schematic capture, lab equipment, and platform troubleshooting.
• Strong knowledge of OCP DC-SCM standards and ecosystem partnerships.

Responsibilities

• Drive TCU-based embedded systems from concept to high-volume production with hands-on execution.
• Take complex boards to mass production, optimize DFM/DFT, test coverage, and yields.
• Oversee field returns, perform Failure Analysis and corrective actions for reliability.

Skills

Circuit design

Schematic capture

Lab equipment

Linux scripting

Open hardware

Education

B.S./M.S. Electrical Engineering

Tools

Cadence OrCAD/Allegro

PCIe/USB/I2C/SPI interfaces

OCP standards

Job description

Vice President (VP) of HW Systems Engineering

Job Summary

We are seeking an agile, results-driven VP of HW Systems Engineering to lead our hardware organization. In this highly visible role, you will own the hardware product lifecycle from concept to high-volume production for the Axiado Trusted Control/Compute[GU1] [GU2] Unit (TCU) products. This role requires an executive with elite, hands-on design and debugging capabilities who thrives in the lab and effectively navigates dynamic, supply-chain-constrained environments. You will manage senior engineers and contractors, help customers build secure server infrastructure, and champion open hardware ecosystems like the Open Compute Project (OCP).

Key Responsibilities

• Leadership & Execution: Drive TCU-based embedded systems from initial concept through high-volume production with active, hands-on daily execution.
• Mass Production & Yield: Take complex boards to mass production while optimizing DFM/DFT, factory test coverage, and production yields.
• Sustaining & RMA Support: Oversee the technical resolution of customer field returns, driving Failure Analysis (FA) and corrective actions to improve reliability.
• Root-Cause Triage: Partner with cross-company ASIC, silicon, firmware, and software teams to systematically isolate and resolve complex system bugs.
• Lab Validation: Personally lead first-silicon and platform bring-up, low-level bus validation, and EVT/DVT testing in the lab.
• OCP & Industry Forums: Integrate OCP DC-SCM standards and represent the company within OCP and other industry hardware forums.
• Supply Chain Agility: Pivot board layouts responsively based on real-time parts availability and manage critical tier-1 supplier relationships.
• Design & Review: Drive schematic development in Cadence OrCAD and collaborate with Layout, Mechanical, and SI engineers to meet OCP DC-SCM and NVIDIA IFF form factors.

Qualifications

• Experience & Education: 20+ years of hardware engineering experience with a leadership track record in server, data center, or semiconductor ecosystems. B.S. or M.S. in Electrical Engineering (EE).
• Production Track Record: Proven history of taking complex board designs to high-volume production with excellent yields and resolving field RMA issues.
• Hands-on Technical Mastery: Deep, continuous experience with circuit design, schematic capture, laboratory equipment, and platform troubleshooting.
• DC-SCM & Ecosystem Expertise: Strong knowledge of OCP DC-SCM standard solutions (DC-SCI interface, form factors) and a solid network across hyperscaler and OEM partners.
• Supply Chain Agility: Demonstrated capability to execute rapid hardware redesigns, footprint compatibility strategies, and alternative component sourcing.
• Tool & Interface Proficiency: Expert familiarity with Cadence OrCAD/Allegro and server interfaces (PCIe, USB, I2C, SMBus, SPI, UART, USB, MCTP, eSPI, LTPI).
• Architecture & Software Knowledge: Solid understanding of modern CPU/GPU architectures and the Linux environment (including Python or Bash scripting).
• Communication: Exceptional verbal and written communication skills to articulate hardware-anchored security and supply chain strategy to enterprise stakeholders.