Via Fill & Planarization Operator — Night Shift

TTM Technologies Inc.; San Jose (CA); On-site; USD 42,000 - 66,000; Full time

Benefits offered by this job

Health benefits

401k

Paid time off

Holidays

Flexible spending accounts

Job summary

TTM Technologies, Inc. is seeking a Via Fill Operator to support via fill and planarization processes, ensuring high-quality copper bonding on PCB surfaces.

You will read travelers, inspect holes, apply non-conductive paste, and operate Mass via fill and planarization equipment in a manufacturing environment. The role requires English communication, the ability to stand for long periods, lifting up to 30 lbs, and safe handling of solvents.

Qualifications

• Ability to read, write and communicate in English to perform the job.
• Must stand for the shift and lift up to 30 lbs.
• Must be able to work with solvent materials.

Responsibilities

• Read and interpret shop traveler to verify WO number and panel quantity, as well as ensure that all previous operation were completed.
• Read and interpret document instructions carefully and correctly.
• Inspect work product prior to processing through via-fill equipment for plug holes, void holes and any abnormality in the quality of the holes.
• Apply non-conductive paste onto equipment which will be applied onto boards.
• Operate Mass via fill equipment and Pola Massa and SV-100 planarization systems.
• Inspect, verify and approve sustainability of via fill/planarization process prior to moving it to the next department.
• Follow all departmental process procedures correctly and respectively.
• Complete all departmental documentation accurately including traveler.
• Maintain a safe, neat and orderly workplace in compliance with DDi Safety Policies.
• Follow all safety measures when handling chemicals and hazardous waste.

Skills

Read/Write English

Stand for shift

Lift up to 30 lbs

Work with solvents

Education

High School diploma or equivalent

Job description

TTM Technologies, Inc. is seeking a Via Fill Operator to support via fill and planarization processes, ensuring high-quality copper bonding on PCB surfaces.

You will read travelers, inspect holes, apply non-conductive paste, and operate Mass via fill and planarization equipment in a manufacturing environment. The role requires English communication, the ability to stand for long periods, lifting up to 30 lbs, and safe handling of solvents.