Thin Films & Implant Process Engineering Intern

Onsemi; New York (NY); Hybrid; USD 36,000 - 61,000; Full time

Benefits offered by this job

Competitive pay

Medical benefits

Flexible hours

ERGs and networking events

Job summary

onsemi is offering a Summer 2027 internship in Fishkill, NY, focused on thin films, implant, and diffusion engineering. Interns will work on defining, developing, and implementing manufacturing processes for integrated circuits within a collaborative team.

Candidates are BA/BS to PhD students in electrical engineering or semiconductor-related fields, with coursework in wafer processing and strong data-analytic and communication skills.

Qualifications

• Pursuing BA/BS, Master or PhD in electrical engineering or semiconductor-related field.
• Classes on Semiconductor and wafer processing.
• Perform statistical data analysis and present results to the team.
• Occasionally help with characterization work in the laboratory.
• Ability to solve problems individually or as part of a team and collaborate across functions.
• Excellent verbal and written communication skills.

Responsibilities

• Collaborate with engineering teams to develop, improve and execute process improvements.
• Review and optimize standards and documentation.
• Investigate and resolve real world manufacturing challenges.

Job description

onsemi is offering a Summer 2027 internship in Fishkill, NY, focused on thin films, implant, and diffusion engineering. Interns will work on defining, developing, and implementing manufacturing processes for integrated circuits within a collaborative team.

Candidates are BA/BS to PhD students in electrical engineering or semiconductor-related fields, with coursework in wafer processing and strong data-analytic and communication skills.