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QuantumScape is seeking a Thermal/Mechanical Engineer to own the physical design of a high-density rack power shelf for hyperscale data centers. You will translate battery packs and power electronics into a manufacturable enclosure that fits standard 1U/2U rack spaces and endures demanding thermal environments.
You will run CFD simulations, optimize airflow, and collaborate with Battery Systems Engineering to ensure reliable thermal performance and manufacturability.
Location: San Jose, CA (On-site)
Reports To: Head of Engineering, Data Center Power Platform
We are building an integrated PSU + BBU rack power shelf that combines power conversion and solid-state battery backup into a single high-density platform for hyperscale AI data centers.
This shelf must conform to OCP Open Rack / ORv3 mechanical specifications, manage two thermally incompatible subsystems within a shared enclosure, and pass hyperscaler qualification—where mechanical and thermal design are just as critical as electrical performance.
As the Thermal / Mechanical Engineer, you will own the complete physical design of the product. You will translate circuit boards and battery packs into a manufacturable shelf that fits industry-standard racks, survives demanding data center environments, and can be serviced by a technician in seconds.
Design the complete mechanical enclosure (1OU or 2OU shelf) using SolidWorks or Creo, including:
Solve the core thermal challenge of integrating:
Perform CFD thermal simulations using:
Optimize airflow under worst-case operating conditions including:
Design to OCP ORv3 mechanical specifications, including:
Develop hot-swap sled mechanisms featuring:
Collaborate with Battery Systems Engineering on:
Perform vibration and shock analysis for:
Lead Design for Manufacturing (DFM) activities with contract manufacturers, including:
Support UL 62368-1 mechanical and flammability requirements including:
Interface directly with hyperscaler mechanical integration teams throughout product qualification.
8+ years designing thermal-mechanical enclosures for:
Demonstrated expertise with CFD thermal simulation tools including:
Proficiency with SolidWorks or Creo for detailed mechanical design.
Extensive sheet metal design experience for high-volume manufacturing, including:
Proven track record taking products through contract manufacturing and thermal validation in production or hyperscale data center environments.
Strong understanding of airflow management in forced-convection rack systems.
Direct experience with OCP Open Rack / ORv3 mechanical specifications.
Experience with battery pack thermal management in:
Exposure to liquid cooling or cold plate design for next-generation rack power shelves.
Experience integrating blind-mate high-power connectors from manufacturers such as:
Familiarity with:
Experience with vibration and shock testing to:
Hyperscalers do not negotiate on rack geometry. If the shelf does not fit, does not cool effectively, or cannot be serviced in seconds, it will never be evaluated—regardless of how strong the electrical design is.
You will serve as the company's primary mechanical interface with hyperscaler qualification teams. Your understanding of both published and practical mechanical integration requirements can shorten qualification timelines by months.
In a product where high-power electronics and solid-state battery cells share the same enclosure, you are the engineer responsible for making that coexistence physically possible.