Thermal Mechanical Engineer for Next-Gen Semiconductor Test

LitePoint; Agoura Hills (CA); On-site; USD 100,000 - 160,000; Full time

Benefits offered by this job

Medical benefits

Dental benefits

Vision benefits

FSA

Retirement plan

Life & disability insurance

Paid vacation & holidays

Tuition assistance

Job summary

Teradyne in Agoura Hills is expanding its centralized mechanical engineering capability to support next-generation semiconductor test equipment. You will own thermal design recommendations, model-to-test correlation, liquid cooling trade-offs, design verification, and closure of thermal risks for complex capital equipment.

This is a career-level role with ownership across design, analysis, prototype, integration, and validation work.

Qualifications

• Bachelor's degree in Mechanical Engineering or related discipline with typically 5+ years of relevant experience, or Master's degree with typically 3+ years of relevant experience.
• Strong experience with board-level thermal analysis, liquid cooling, cold plates, and thermal-mechanical design.
• Experience using thermal or CFD tools such as Flotherm, SolidWorks Flow Simulation, or similar tools.
• Experience with liquid delivery systems such as pumps, filters, piping, fittings, and cooling loops.
• Proficiency with SOLIDWORKS and PDM or similar engineering data management systems.
• Ability to independently solve engineering problems, make sound design trade-offs, and communicate recommendations clearly.
• Strong written and verbal communication skills, including design reviews, technical reports, and cross-functional presentations.
• Proactive, hands‑on mindset with the ability to take ownership of assigned work and collaborate effectively across engineering teams.

Responsibilities

• Own thermal analysis and validation plans for assigned components or subsystems.
• Develop board-level and system-level cooling solutions for next-generation semiconductor test equipment.
• Evaluate liquid cooling architectures, cold plates, heatsinks, fluid connectors, and related thermal-mechanical hardware.
• Perform thermal analysis, liquid cooling analysis, and CFD modeling to support design decisions.
• Correlate simulation results with experimental test data and translate findings into clear design recommendations.
• Lead design reviews for assigned scope and drive closure of thermal risks, action items, and verification gaps.
• Collaborate with suppliers and cross-functional teams on manufacturable thermal-mechanical solutions.

Skills

Board-level thermal analysis

Liquid cooling design

Thermal-mechanical design

CFD modeling

Design verification

Cross-functional collaboration

Communication skills

Problem solving

Proactive ownership

Education

Bachelor's degree in Mechanical Engineering or related discipline

Master's degree (optional)

Tools

Flotherm

SolidWorks Flow Simulation

SOLIDWORKS

PDM

Job description

Teradyne in Agoura Hills is expanding its centralized mechanical engineering capability to support next-generation semiconductor test equipment. You will own thermal design recommendations, model-to-test correlation, liquid cooling trade-offs, design verification, and closure of thermal risks for complex capital equipment.

This is a career-level role with ownership across design, analysis, prototype, integration, and validation work.