Thermal Engineer - Server & Liquid Cooling Systems

Foxconn Industrial Internet - FII; Houston (TX); On-site; USD 120,000 - 160,000; Full time

Job summary

Foxconn Industrial Internet - FII is seeking a Thermal Engineer for its Server R&D Team to design and optimize thermal management from concept to mass production for server and rack products. You will use advanced simulation and testing to ensure performance and reliability.

Responsibilities include leading cooling solutions, performing simulations with FloTherm, Icepak and Ansys CFD, planning environmental tests, and collaborating with mechanical, electrical, and manufacturing groups to meet

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or Aerospace Engineering.
• 5+ years of thermal design experience in server or data center products.
• Hands-on liquid cooling design experience.
• Strong knowledge of thermodynamics, heat transfer, and fluid dynamics.
• Experience with FloTherm, Icepak or Ansys CFD.
• Experience with 3D CAD tools (Creo, SolidWorks, UG NX).
• Strong communication in English; Mandarin preferred.
• Familiarity with PDM (Windchill) and Agile processes.

Responsibilities

• Lead thermal management design for server and rack systems, including chip, board, system, and rack-level solutions.
• Conduct thermal simulations and optimization using FloTherm, Icepak, and Ansys CFD.
• Plan and execute thermal tests, including environmental chamber testing.
• Analyze and optimize airflow and cooling solutions, including liquid or hybrid cooling.
• Collaborate with mechanical, electrical, and manufacturing teams and customers to meet thermal performance and production requirements.
• Participate in customer technical reviews, provide design recommendations, and resolve issues promptly.
• Build strong client relationships by refining technical solutions to match customer expectations.
• Review new technologies and materials to ensure designs meet industry trends and future needs.
• Prepare detailed test reports and documentation to support reviews.
• Coordinate with Taipei and global R&D centers; requires strong English and Mandarin communication.

Skills

Thermal design

Server/data center cooling

Cross-functional collaboration

Problem-solving

Education

Bachelor's or Master's in Mechanical Engineering

PhD (preferred)

Tools

FloTherm

Icepak

Ansys CFD

PTC Creo

SolidWorks

UG NX

Windchill

Job description

Position: Thermal Engineer – Server R&D Team

We are seeking a highly skilled Thermal Engineer specializing in thermal management design for server and rack products. This role involves developing thermal solutions from concept to mass production, utilizing advanced simulation and testing techniques to ensure product performance and reliability.

Key Responsibilities:

• Lead thermal management design for server and rack systems, including chip, board, system, and rack-level thermal solutions.
• Conduct thermal simulation and optimization using advanced tools such as FloTherm, Icepak, and Ansys CFD.
• Plan and execute thermal tests, including operating environmental chambers to validate design performance and reliability.
• Analyze and optimize airflow management systems and design efficient cooling solutions, such as liquid cooling or hybrid cooling technologies.
• Collaborate with cross-functional teams (mechanical design, electrical design, and manufacturing) and customers to ensure designs meet thermal performance, production requirements, and client-specific needs.
• Actively participate in customer technical review meetings, provide design recommendations, and resolve technical issues promptly.
• Build strong client relationships by working closely with customers to refine technical solutions and ensure alignment with their expectations.
• Review and evaluate new technologies and materials to ensure thermal design meets industry trends and future needs.
• Prepare detailed test reports and technical documentation to support internal and customer design reviews.
• Work closely with Taipei and other global R&D centers, requiring strong communication skills in English and Mandarin

Qualifications:

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or Aerospace Engineering. A Ph.D. is a plus.

• 5+ years of thermal design experience specifically in server or data center products

• Hands-on experience in liquid cooling design (cold plate, pump loop, coolant selection, leak risk mitigation)

• Deep understanding of thermodynamics, heat transfer, and fluid dynamics, with practical application in design and testing.
• Expertise in thermal simulation tools (e.g., FloTherm, Icepak, Ansys CFD) and 3D/2D CAD tools (e.g., PTC Creo, SolidWorks, UG NX).
• Hands-on experience with server thermal testing equipment, including environmental chambers and airflow measurement devices.
• Ability to develop and optimize liquid cooling solutions and a strong understanding of hybrid cooling technologies.
• Familiarity with fan module design and airflow control techniques.
• Excellent analytical and problem-solving skills, with the ability to perform trade-off analysis and evaluate multiple design options efficiently.
• Strong cross-functional and customer communication skills, with fluency in English required; Mandarin proficiency preferred.
• Familiarity with Product Data Management (PDM) systems such as Windchill and experience with Agile Development processes.

Additional Advantages:

• Familiarity with rack server design specifications and data center operational requirements.
• Experience in developing products for hyperscale data centers is highly desirable.
• Deep knowledge of industry thermal standards, such as ASHRAE TC 9.9, and the ability to apply them in product design.