Thermal Engineer

Arieca Inc.; Pittsburgh (Allegheny County); On-site; USD 70,000 - 90,000; Full time

Benefits offered by this job

Healthcare

Flexible PTO

Stock options

401(k) matching

Job summary

Arieca Inc. is actively seeking a Thermal Engineer to join our Hardware R&D team in Pittsburgh, United States. This role focuses on designing and implementing liquid cooling solutions for our innovative thermal interface materials.

The ideal candidate will have relevant experience in cooling solutions, thermo-mechanical properties, and direct interaction with customers and vendors. Competitive salary and benefits include healthcare, flexible PTO, and stock options.

Qualifications

• 1-3 years of experience in industry or academic research laboratory.
• Hands-on work on single phase liquid cooling solutions.
• Familiarity with thermomechanical simulation tools.

Responsibilities

• Design and implement liquid cooling solutions for thermal test vehicles.
• Develop experiments to test thermo-mechanical properties of semiconductor interfaces.
• Create professional customer-facing documentation.

Skills

Single phase liquid cooling solutions

Microcontrollers (Arduino, Raspberry Pi)

Thermal science and material characterization

Thermomechanical simulation tools (Ansys, Autodesk Fusion)

Scientific programming (Python, Matlab, C++)

GUI design expertise (LabView)

Education

Bachelor of Science in Mechanical Engineering, Electrical Engineering, or equivalent

Job description

Thermal Engineer – Full Time Job Opportunity

Who We Are:

Arieca is leading the commercialization of easy to deploy liquid metal embedded elastomer (LMEE) technologies, which enable unprecedented performance in applications across semiconductor, electronics, automotive, and healthcare industries. Our TIMbber TM product line targets leading semiconductor thermal interface material (TIM) challenges. As a CMU spin-out, venture-backed company, we are expanding our team to bring our lab innovations to market.

What We Need:

Arieca is looking for a Thermal Engineer who will join our Hardware R&D team to assist the successful market introduction of our thermal interface materials (TIM). Responsibilities include design and implementation of liquid cooling solutions for thermal test vehicles, in addition to designing and implementing experiments to test hypotheses on understanding the thermo-mechanical properties of semiconductor interfaces in packaged electronics (smartphones, laptops, GPUs). Strong organizational, analytical and communication skills are required, as we need to collect data efficiently and create professional customer facing documentation, while developing processes and systems that work well within the constraints of a startup. Engagement with customers, external vendors and ecosystem partners is possible.

You will be working with a team of highly motivated and ambitious individuals with a diverse background of exceptional scientific, entrepreneurial, and industrial experiences. This position offers competitive salary and benefits including healthcare, flexible PTO, stock options, and 401(k) matching.

Key Requirements:

• Minimum of 1-3 years of experience working in industry or an academic research laboratory, withs significant hands-on work on single phase liquid cooling solutions (implementation of cold plates, heaters, thermocouples, pumps, chillers, etc.)
• Experience with microcontrollers like Arduino and Raspberry Pi for real time physical control and data collection/processing and system management
• Solid foundation in thermal science, including material characterization (e.g. ASTM D5470, thermal test vehicles)
• Familiar with at least one thermomechanical simulation tool (Ansys, Autodesk Fusion, etc.).
• Experience with scientific programming in Python, Matlab, or C++. On the job, we will develop GUIs for DAQ systems, so expertise here is a bonus. Significant skills designing GUIs in LabView can substitute here.
• Bachelor of Science or higher in Mechanical Engineering, Electrical Engineering, Mechatronics, or equivalent degrees.
• Meticulous organizational skills, attention to detail, and pride in producing high-quality work

Nice to have:

• Experience designing analog electrical circuits, semiconductor packages or substrates (flip-chip, BGA, LGA, etc.), or data acquisition systems
• Rapid prototyping and machine shop experience.
• Experience in semiconductor industry, nondestructive testing or reliability engineering.

Arieca is committed to principles of diversity and inclusion, and encourages candidates to apply even if they do not exhibit all of the above-mentioned characteristics.