Thermal Design Engineer: Data Center HVAC & CAD

Rapsys Technologies Pte Ltd.

Kentucky

On-site

USD 65,000 - 110,000

Full time

7 days ago
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Job summary

Rapsys Technologies Pte Ltd. is seeking a Mechanical Engineer to design thermal and ventilation systems for data centers and IT facilities. You will develop drawing packages and layout drawings for equipment integration, coordinating with structural and electrical teams to ensure seamless implementation.

Candidates should have a Mechanical Engineering / Thermal Engineering degree, experience in HVAC design, and proficiency in AutoCAD / Autodesk, with CFD analysis capability as a plus.

Qualifications

  • Bachelor's degree in Mechanical Engineering / Thermal Engineering required.
  • Experience with thermal and ventilation system design for data centers or IT facilities.
  • HVAC design experience and ability to create equipment layouts.
  • Proficiency with AutoCAD / Autodesk and ability to interpret construction drawings.
  • Familiarity with CFD analysis and mechanical submittals.

Responsibilities

  • Design thermal and ventilation systems for data centers and IT facilities.
  • Develop drawing packages for integration of mechanical systems and layouts.
  • Coordinate with facility structural design and electrical systems.

Skills

Thermal & ventilation design
HVAC design
Construction drawing interpretation
CFD analysis
Equipment layouts

Education

Bachelor's degree in Mechanical Engineering / Thermal Engineering

Tools

AutoCAD / Autodesk
Microsoft Office

Job description

Rapsys Technologies Pte Ltd. is seeking a Mechanical Engineer to design thermal and ventilation systems for data centers and IT facilities. You will develop drawing packages and layout drawings for equipment integration, coordinating with structural and electrical teams to ensure seamless implementation.

Candidates should have a Mechanical Engineering / Thermal Engineering degree, experience in HVAC design, and proficiency in AutoCAD / Autodesk, with CFD analysis capability as a plus.

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