Thermal Analyst, Mechanical Engineer – Avionics Packaging

Harris Geospatial Solutions; Palm Bay (FL); Hybrid; USD 90,000 - 120,000; Full time

Job summary

L3Harris Technologies seeks an Electronic Packaging Mechanical Engineer specializing in thermal analysis to drive the thermal design of avionics electronics from concept through hardware integration and test.

Responsibilities include CFD analysis, first-order thermodynamics, and collaboration with design, systems, and program management teams to meet stringent technical and schedule requirements.

Qualifications

• Bachelor’s Degree and minimum 4 years of prior relevant experience. Graduate Degree and a minimum of 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience.

Responsibilities

• Supports design and thermal analysis of avionics electronics equipment.
• Performs CFD analyses and first-order thermodynamics calculations.
• Interacts with Designers, Analysts, Systems Engineers, and Program Managers.
• Documents design intent and provides regular status updates.
• Contributes to milestone reviews (PDR, CDR, TRR) and risk assessments.
• Independent contributor with potential to lead tasks within discipline to meet schedule.

Skills

Thermal analysis

CFD

Communication skills

Team collaboration

Hands-on

Education

Bachelor’s Degree or higher

4+ years of relevant experience

Graduate Degree preferred

Tools

FloTHERM

ANSYS

Icepack

StarCCM

OpenFOAM

Creo

Catia

NX

Fusion 360

SolidWorks

Job description

L3Harris Technologies seeks an Electronic Packaging Mechanical Engineer specializing in thermal analysis to drive the thermal design of avionics electronics from concept through hardware integration and test.

Responsibilities include CFD analysis, first-order thermodynamics, and collaboration with design, systems, and program management teams to meet stringent technical and schedule requirements.