[Summer 2027] TSMC AZ Internship Opportunities - Engineering Roles

TSMC - Taiwan Semiconductor Manufacturing Company Limited; Phoenix (AZ); On-site; USD 40,000 - 50,000; Full time

Benefits offered by this job

Relocation assistance

Potential travel based on business needs

Job summary

TSMC - Taiwan Semiconductor Manufacturing Company Limited in Phoenix, Arizona is offering engineering internship opportunities for Summer 2027. This program includes various roles such as Process Integration Engineer, Yield Excellence Engineer, and Equipment Engineer, each focusing on distinct aspects of semiconductor manufacturing.

Interns will work full-time for 10 weeks, collaborate with experts, and develop their skills in a dynamic environment. Candidates must be pursuing a relevant engineering degree and exhibit strong communication, teamwork, and analytical skills.

Qualifications

• Knowledge of semiconductor manufacturing processes and design is a plus.
• Must be a self-motivated learner and proactive collaborator.
• Ability to lift weights according to safety guidelines.

Responsibilities

• Collaborate with teams to analyze data and solve engineering challenges.
• Participate in on-site technical operations in the cleanroom.
• Apply statistical methods and predictive analytics.

Skills

Strong communication skills

Data analysis

Teamwork

Education

Currently enrolled in an accredited university (Bachelor, Master, Ph.D.)

Job description

[Summer 2027] TSMC AZ Internship Opportunities - Engineering Roles

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona engineering departments are looking for engineering talent to join our advanced technology fab, located in sunny Phoenix, Arizona. As a TSMC Intern, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

Job Roles

• Process Integration Engineer (PID) Intern

  Focus on analyzing Inline and EOL (End-of-Line) electrical data to determine causes for issues, in collaboration with Integration, YED (Yield Excellence Department), and Process/Equipment engineers.

• Yield Excellence Engineer (YED) Intern

  Focus on defect inspection methodology to effectively deduce the root cause of critical issues by collaborating with respective stakeholders and innovate the current techniques to combat defect issues live on the production line.

• Process Engineer (PE) Intern

  Focus on delivering robust and efficient semiconductor manufacturing through data-driven analytics and systematic problem-solving. Optimize processes with experimental design, precision control, and statistical methods. Collaborate with suppliers to address technology gaps and focus on continuous improvement in stability, quality, yield, productivity, and safety.

  • CMP: Chemical Mechanical Planarization
  • CVD: Chemical Vapor Deposition
  • PVD: Physical Vapor Deposition
  • EPI: Epitaxy
  • DIF: Diffusion
  • WET: Wet Clean
  • ME: Metrology
  • Etch: Wet Etch and Dry Etch
  • LIT: Lithography
• Equipment Engineer (EE) Intern

  Focus on improving and maintaining tool performance in a cleanroom environment to ensure quality production. Key duties include troubleshooting alarms, installing and qualifying new tools, resolving critical equipment issues, and improving tool uptime. Additionally, the role involves enhancing hardware capabilities, implementing systems to prevent equipment failures, and managing vendor relationships while coordinating with facilities, vendors, and manufacturing teams.

  • CMP: Chemical Mechanical Planarization
  • CVD: Chemical Vapor Deposition
  • PVD: Physical Vapor Deposition
  • EPI: Epitaxy
  • DIF: Diffusion
  • WET: Wet Clean
  • ME: Metrology
  • Etch: Wet Etch and Dry Etch
  • LIT: Lithography
• Intelligent Manufacturing Engineer Intern (MFG)

  Focus on ensuring the timely delivery of high-quality wafers by driving productivity and efficiency through advanced technologies such as Smart Scheduling and Precise Dispatching. Responsibilities include system optimization, productivity improvement initiatives, and quality defense enhancements to support daily operations.

• Advanced Material Handling System (AMHS) Engineer Intern

  Focus on automated systems that ensure efficient, timely, and accurate wafer transfers. Projects may include improving Delivery Time Accuracy (DTA) or enhancing Stocker dispatching systems to optimize lot movement and cycle times.

Other Engineering Roles

• Quality Management Engineer (AQE) Intern

  Support on TSMC's mission of world‑class quality systems by collaborating with Taiwan's Central Quality team. Your role includes monitoring wafer fabrication processes, analyzing manufacturing parameters, applying statistical methods, and leveraging predictive analytics to optimize process control. You'll also contribute to product success during launches and technology ramps while ensuring compliance with global quality standards.

• Product Engineering (PES) Intern

  Focus on analyzing yield and process issues to support customer needs and drive improvements in semiconductor manufacturing. Your work will involve identifying process and quality "sweet spots" to optimize yield efficiency, performing detailed layout analyses to uncover root causes, and conducting electrical and physical failure analyses to pinpoint process‑stage issues.

• Mask Engineering Intern (EBO)

  Be responsible for ensuring the performance, reliability, and efficiency of photomask tools within our advanced manufacturing operations. This role involves collaborating with tool owners to manage the installation and maintenance of photomask equipment, partnering with tool vendors to improve maintenance processes, and developing in‑line monitoring systems to proactively identify and address potential issues.

• Central Start‑Up (CST) Tool Install Engineer Intern

  Focus on supporting the installation of manufacturing equipment and tools by conducting site assessments, preparing installation plans, and coordinating timelines with internal teams. You will work on projects such as surveying construction sites to identify optimization opportunities, developing improvement proposals, and presenting findings through reports or visual presentations. Demonstrate project management skills by identifying bottlenecks in the installation process and recommending solutions to streamline operations.

• Industrial Safety & Health (ISEP) Engineer Intern

  Focus on supporting and promoting workplace safety and environmental sustainability efforts in advanced semiconductor facilities. Collaborate with departments to implement safety protocols, evaluate hazards (e.g., radiation, lasers, gases, chemicals), conduct risk assessments, and refine high‑risk SOPs to ensure a safe and compliant work environment.

• Computer Integrated Manufacturing (CIM) Engineer Intern

  Be part of TSMC's DevOps team to tackle analytical projects and machine vision tasks that address production line issues. Work on projects like pattern recognition, machine learning, and web development while learning agile software development, implement Prometheus and Grafana monitoring services that were deployed to Kubernetes platform, implemented automated deployment pipelines utilizing Microsoft Azure DevOps and machine learning/statistics model or algorithms developed.

Minimum Qualifications for all roles

Applicants must be legally eligible to work in the United States and be currently enrolled at an accredited university in a Bachelor, Master, Ph.D. degree in Electrical Engineering, Material Science, Chemical Engineering, Chemistry, Mechanical Engineering, Physics, Industrial Engineering, Civil Engineering, Construction or related engineering fields.

Must be able to work full‑time for 10 weeks (40 hours per week) on-site at our Phoenix location from:
(indirectly represented below)

• Semester system: May 24, 2027 to August 6, 2027; June 7, 2027 to August 20, 2027
• Quarter system: June 14, 2027 to August 27, 2027

Knowledge of semiconductor manufacturing process and design would be a strong addition.

Flexibility to change priorities and responsibilities to support business needs.

The candidate will be expected to be a self‑motivated learner, proactive collaborator, and should be prepared to work in a team presenting and discussing their work and ideas.

Strong communication, computer, presentation, listening, and teamwork skills are required to contribute to the team and TSMC Arizona’s culture.

Some roles may require the ability to: (a) lift weights in accordance with applicable regulations and safety guidelines, including NIOSH lifting recommendations; (b) work in a cleanroom environment, gowning up in coveralls, hoods, boots, safety glasses and gloves. Spend significant time on the factory floor working on the tools.

Work Location

Phoenix, AZ

Travel

May require travel dependent on business needs.

Relocation Assistance

Relocation assistance available.

Export Control Note

All positions may require access to export controlled technical data. Non‑U.S. Persons may require an export license. U.S. Persons include United States citizens, lawful permanent residents, and persons admitted to the United States as a refugee or asylee.