Senior Member of Technical Staff, Thin Films Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 156,000 - 298,000; Full time

Benefits offered by this job

Hybrid work model

Job summary

Intel Corporation is seeking a senior technical leader to drive process innovation in thin film deposition across CVD, ALD, PVD, and related technologies. The role bridges Technology Development and High-Volume Manufacturing, guiding transitions from development to production for Intel's advanced nodes.

You will lead cross-functional teams, optimize equipment performance, and deliver rapid, practical solutions aligned with customer requirements and strategic business goals.

Qualifications

• Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or STEM.
• 5+ years semiconductor industry experience with emphasis on thin film deposition.
• Experience with process development, leadership, and manufacturing engineering.
• Experience collaborating with equipment suppliers on process optimization.
• Fab startup experience across manufacturing, quality, R&D, and supply chain.
• Experience with SPC, DOE, and factory automation systems.

Responsibilities

• Champion safety, quality, yield, throughput, and cost optimization in thin film deposition.
• Reduce defects and improve uniformity through process enhancements.
• Lead technical problem resolution and deliver scalable solutions.
• Optimize equipment performance with internal teams and suppliers.
• Align technical vision with customer requirements and business goals.
• Synthesize data to inform strategic decisions and roadmaps.
• Own end-to-end resolution of manufacturing challenges across disciplines.
• Deliver rapid execution of innovative solutions within development timelines.
• Collaborate with Technology Development, HVM, and Business Groups.
• Present findings to engineers and executives; accelerate decision-making.

Skills

Problem solving

Leadership

Cross-functional collaboration

Strategic thinking

Communication

Education

Master's degree in Electrical/Mechanical/Chemical Engineering or Materials Science

Tools

AMAT

LAM

ASM

TEL

Job description

Job Details: Job Description: Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.

About This Role

Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.

Your Mission

Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.

Key Responsibilities

• Process Innovation and Excellence: Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
• Drive defectivity reduction and uniformity improvements through systematic process enhancement.
• Lead technical problem resolution and deliver solutions that meet aggressive technology node targets.
• Optimize equipment performance working with internal teams and key suppliers.
• Strategic Technical Leadership: Align technical vision with customer requirements and business objectives.
• Synthesize complex technical data to formulate and execute strategic responses.
• Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
• Deliver rapid execution of innovative solutions to meet challenging development timelines.
• Cross-Functional Partnership: Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups.
• Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers.
• Present technical findings effectively to diverse audiences from engineering teams to executive leadership.
• Foster in-person collaboration to accelerate decision-making and problem resolution.
• Industry Leadership: Stay current with semiconductor industry trends and emerging process technologies.
• Drive strategic initiatives that position Intel at the forefront of manufacturing innovation.
• Contribute to technology roadmaps through hands-on technical expertise and market insight.

What We're Looking For

• Technical Excellence: Results‑driven professional with exceptional technical problem‑solving abilities.
• Proven track record of significant accomplishments across multiple technology nodes.
• Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction.
• Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer.
• Leadership Capabilities: Outstanding communication skills for presenting complex technical information to varied audiences.
• Self‑motivated with strong initiative and ability to navigate ambiguous technical challenges.
• Demonstrated ability to manage multiple high‑priority projects under pressure while maintaining quality focus.
• Experience driving clarity in complex technical situations and leading cross‑functional initiatives.
• Industry Expertise: Comprehensive knowledge of process development, materials science, and device physics.
• Ability to interpret industry trends and translate market dynamics into actionable technical strategies.
• Experience with foundry business models and customer engagement requirements.
• Proven capability to work independently while managing diverse technical assignments.
• Semiconductor foundry experience.

Qualifications

1. Minimum Qualifications
   • Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field.
   • 5+ years semiconductor industry experience with strong focus on thin film deposition processes.
   • Proven experience in process development, technical leadership, and manufacturing engineering.
   • Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization.
   • Fab startup experience across manufacturing, quality, R and D, and supply chain functions.
   • Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
2. Preferred Qualifications
   • Ph.D. in Electrical/ Mechanical or Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies.
   • Experience in Gate All Around (GAA) logic technologies within semiconductor foundry environments.
   • Experience delivering customized solutions across Technology Development and HVM organizations.
   • Cross‑functional leadership experience managing diverse stakeholder groups.

Why This Role Matters

This high‑visibility position directly impacts Intel's foundry competitiveness and customer success. You will work on industry‑defining technologies while building expertise that positions you as a leader in advanced semiconductor manufacturing.

Work Environment

This role emphasizes collaborative, in‑person work to enable rapid innovation cycles and real‑time problem resolution in Intel's state‑of‑the‑art manufacturing facilities.

Ready to Shape the Future?

Join Intel's mission to push the boundaries of semiconductor manufacturing technology. Your expertise will directly influence the next generation of computing innovations and manufacturing excellence.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for US

$155,520.00-298,440.00 USD (the range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.)

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on‑site at their assigned Intel site and off‑site.

Additional Information

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.