Staff Yield Engineer

NOKIA; San Jose (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Nokia in California is seeking a Staff Yield Engineer to lead yield improvement initiatives and develop scalable process control methodologies for a rapidly growing InP PIC wafer fab. This role operates with a high degree of independence in a fast-paced manufacturing environment, driving complex technical issues from problem identification through sustainable corrective actions.

You will work with Integration, Process, Equipment, and Manufacturing Operations to improve fab yield and ramp

Qualifications

• PhD preferred, or MS in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering discipline.
• 5-10 years of experience in semiconductor or HDD high-volume manufacturing (HVM).
• Hands‑on experience in yield improvement, process control, process integration, or manufacturing engineering.
• Experience investigating yield excursions and driving structured problem‑solving is strongly preferred.
• Demonstrated ability to independently drive complex technical issues and implement sustainable corrective actions in a fast‑paced manufacturing environment.
• Strong analytical and statistical skills with experience in SPC, DOE, JMP (or equivalent statistical tools), and data‑driven decision making.

Responsibilities

• Lead yield improvement initiatives by identifying key yield detractors, prioritizing improvement opportunities, and driving structured problem-solving to improve fab performance and manufacturing robustness.
• Develop and deploy practical process control methodologies and control plans to reduce process variation and support stable high-volume manufacturing.
• Support root cause investigations for critical yield excursions and complex manufacturing issues by applying structured engineering analysis and data-driven techniques.
• Drive cross-functional resolution of yield excursions, scrap, and quality incidents by coordinating teams using structured 8D methodology.
• Contribute to continuous improvement of manufacturing quality systems by strengthening SPC methodology and data visibility.

Skills

Yield improvement

Process control

Root cause analysis

Cross-functional collaboration

8D problem solving

Six Sigma

SPC

Data-driven decision making

Education

MS in Materials Science

MS in Electrical Engineering

PhD preferred

Related engineering discipline

Tools

JMP

DOE

Job description

Role Summary

We are seeking a Staff Yield Engineer to lead yield improvement initiatives and develop scalable process control methodologies for a rapidly growing InP photonic integrated circuit (PIC) wafer fab.

This role operates with a high degree of independence in a fast-paced manufacturing environment, driving complex technical issues from problem identification through sustainable corrective actions. Working closely with Integration, Process, Equipment, and Manufacturing Operations, the engineer will play a key role in improving fab yield performance, enabling Fab2 ramp readiness, and strengthening manufacturing quality systems.

Key Responsibilities

Lead Yield Improvement

Lead yield improvement initiatives by identifying key yield detractors, prioritizing improvement opportunities, and driving structured problem-solving to improve fab performance and manufacturing robustness.

Process Control

Develop and deploy practical process control methodologies and control plans to reduce process variation and support stable high-volume manufacturing. Support new product ramp readiness by translating proven process control methodologies and manufacturing best practices from Fab to Fab into scalable monitoring and control frameworks.

Root Cause Investigation

Support root cause investigations for critical yield excursions and complex manufacturing issues by applying structured engineering analysis, manufacturing data, and appropriate analytical techniques to identify effective corrective and preventive actions.

Cross-functional Execution

Drive cross-functional resolution of critical yield excursions, wafer scrap, and quality incidents by coordinating Integration, Process, Equipment, Facilities, and Manufacturing teams using structured 8D methodology. Demonstrate strong ownership, urgency, and execution discipline to ensure timely and sustainable closure.

Quality Governance

Contribute to continuous improvement of manufacturing quality systems by strengthening SPC methodology, excursion management, control plan execution, data visibility, and quality governance practices.

Qualifications

• PhD preferred, or MS in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering discipline.
• 5-10 years of experience in semiconductor or HDD high-volume manufacturing (HVM).
• Hands‑on experience in yield improvement, process control, process integration, or manufacturing engineering. Experience investigating yield excursions and driving structured problem‑solving is strongly preferred.
• Demonstrated ability to independently drive complex technical issues and implement sustainable corrective actions in a fast‑paced manufacturing environment.
• Strong analytical and statistical skills with experience in SPC, DOE, JMP (or equivalent statistical tools), and data‑driven decision making.
• Excellent communication and cross‑functional influencing skills, with the ability to build alignment and drive execution across Integration, Process, Equipment, Manufacturing, and Quality organizations without direct authority.
• Experience with 8D problem solving, excursion management, Six Sigma methodologies, and continuous process improvement is highly desirable.