Staff Process Engineer - Backside Processing & CMP/Thermal

NOKIA; San Jose (CA); On-site; USD 140,000 - 200,000; Full time

Job summary

Nokia Optical Networks is seeking a Staff Process Engineer to lead backside processing, CMP, and thermal processing development for InP photonic devices. You will own thinning technologies, optimize CMP and thermal steps, and drive yield and defect reduction in a 24x7 manufacturing environment.

You will collaborate with lithography, etch, thin film, reliability, and device teams to deliver manufacturable processes, using DOE, SPC, and AI-enabled analytics to improve performance and reliability.

Qualifications

• MS or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related technical discipline.
• BS degree with 5+ years of semiconductor, photonics, or advanced manufacturing experience will also be considered.
• Strong experience in wafer thinning, backside processing, CMP, thermal processing, and related semiconductor manufacturing technologies.
• Experience with semiconductor process development, integration, yield improvement, and production support.

Responsibilities

• Develop, qualify, and sustain backside wafer processing, wafer thinning, lapping, grinding, CMP, and thermal processes for InP photonic integrated circuit manufacturing.
• Own and optimize wafer thinning technologies including mechanical grinding, lapping, polishing, stress relief, and final substrate thickness control.
• Develop and optimize CMP processes for planarization, surface finish improvement, thickness control, defect reduction, and yield enhancement.
• Own thermal processes including annealing, alloy formation, furnace processing, RTP (Rapid Thermal Processing), bake processes, and temperature‑sensitive material integration.

Skills

Wafer thinning

Backside processing

CMP

Thermal processing

DOE

SPC

Data analytics

Problem solving

Cross-functional collaboration

Manufacturing leadership

Education

MS or PhD in Materials Science/Mechanical/Electrical/Chemical Engineering or Physics

BS with 5+ years in semiconductor photonics/advanced manufacturing

Tools

Polishing systems

Grinding equipment

Furnace systems

RTP tools

Process control tools

Job description

Nokia Optical Networks is seeking a Staff Process Engineer to lead backside processing, CMP, and thermal processing development for InP photonic devices. You will own thinning technologies, optimize CMP and thermal steps, and drive yield and defect reduction in a 24x7 manufacturing environment.

You will collaborate with lithography, etch, thin film, reliability, and device teams to deliver manufacturable processes, using DOE, SPC, and AI-enabled analytics to improve performance and reliability.