Staff Assembly Process Engineer - Die Attach & Wirebond

NOKIA

Sunnyvale (CA)

On-site

USD 150,000 - 190,000

Full time

5 days ago
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Job summary

Nokia is seeking an experienced Process Engineer to develop, sustain, and improve die attach, wirebond, and inspection processes in a 24/7 assembly facility for monolithically integrated optical circuits. You will own processes, analyze MTBA/MTBF, and guide NPI through tool qualification and process optimization.

You will lead cross-functional teams, mentor operators, and drive improvements in yield, cycle time, and reliability while ensuring clean-room and safety standards are upheld.

Qualifications

  • Bachelor's degree in electrical, mechanical, or materials engineering with 8 years of related experience, or master's degree with 5 years in semiconductor packaging & assembly.
  • Experience in die attach, wirebond, and related assembly processes in a manufacturing environment.
  • Strong background in process ownership, tool qualification, and NPI support.

Responsibilities

  • Own multiple COC assembly processes (wirebond, eutectic die attach).
  • Lead and develop expertise across the manufacturing process flow.
  • Analyze and improve processes to meet KPIs like efficiency, cycle time, yield, and reliability.
  • Perform controlled experiments to reduce variability; present results.
  • Create procedures and mentor operators and technicians.
  • Select, procure, install, and qualify new tools.
  • Define assembly requirements for new product introductions.

Skills

Process ownership
Hands-on tooling
Data analysis
Project management
Communication
Mentorship
SPC/DOE knowledge

Education

Bachelors in Electrical/Mechanical/Materials Eng
Masters in related field

Tools

Micron2/Datacon EVO platform
Metrology equipment
Plasma cleaning equipment
Shop floor control systems

Job description

Nokia is seeking an experienced Process Engineer to develop, sustain, and improve die attach, wirebond, and inspection processes in a 24/7 assembly facility for monolithically integrated optical circuits. You will own processes, analyze MTBA/MTBF, and guide NPI through tool qualification and process optimization.

You will lead cross-functional teams, mentor operators, and drive improvements in yield, cycle time, and reliability while ensuring clean-room and safety standards are upheld.

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