Staff Assembly Process Engineer

NOKIA; Sunnyvale (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Nokia is seeking an experienced Process Engineer to develop, sustain, and improve die attach, wirebond, and inspection processes in a 24/7 assembly facility for monolithically integrated optical circuits. You will own processes, analyze MTBA/MTBF, and guide NPI through tool qualification and process optimization.

You will lead cross-functional teams, mentor operators, and drive improvements in yield, cycle time, and reliability while ensuring clean-room and safety standards are upheld.

Qualifications

• Bachelor's degree in electrical, mechanical, or materials engineering with 8 years of related experience, or master's degree with 5 years in semiconductor packaging & assembly.
• Experience in die attach, wirebond, and related assembly processes in a manufacturing environment.
• Strong background in process ownership, tool qualification, and NPI support.

Responsibilities

• Own multiple COC assembly processes (wirebond, eutectic die attach).
• Lead and develop expertise across the manufacturing process flow.
• Analyze and improve processes to meet KPIs like efficiency, cycle time, yield, and reliability.
• Perform controlled experiments to reduce variability; present results.
• Create procedures and mentor operators and technicians.
• Select, procure, install, and qualify new tools.
• Define assembly requirements for new product introductions.

Skills

Process ownership

Hands-on tooling

Data analysis

Project management

Communication

Mentorship

SPC/DOE knowledge

Education

Bachelors in Electrical/Mechanical/Materials Eng

Masters in related field

Tools

Micron2/Datacon EVO platform

Metrology equipment

Plasma cleaning equipment

Shop floor control systems

Job description

Develop, sustain, and improve process yield for die attach, wirebond, inspection tools and/or process steps in the assembly of monolithically integrated optical circuits in 24x7 manufacturing and development facility. Focus on both process and tool ownership, process, equipment performance (MTBA, MTBF) and NPI.

Responsibilities include

• Become a process owner of many specific COC assembly processes, primarily wirebond and eutectic die attach.
• Peer-lead and develop expertise in specific assembly process modules as well as across the manufacturing process flow.
• Organize, analyze, and improve manufacturing processes to meet key performance indicators including efficiency, cycle time, yield, and reliability.
• Identify and reduce components of variability by conducting controlled experiments, analyzing, summarizing, and presenting results.
• Work in a team environment consisting of engineers, technicians and operators.
• Create written operational procedures and mentor/train operators.
• Responsible for New Tool selection , procurement , installation, and qualifying new tools.
• Work with development and other functional teams to define the assembly requirements for new product introduction.
• Identify, develop, and qualify new assembly processes and technologies to enable and support next generation product needs.
• Represent Assembly Engineering in various multi-functional teams.
• Work in a clean room environment and follow strict clean room requirements.
• Must be available for 24/7 factory on call.

Skills / Experience / Knowledge

• Strong hands-on background in assembly technologies and processes for microelectronics manufacturing
• Hands-on operation and maintenance of assembly process tools and metrology equipment
• Technical expertise and ownership in die attach via solder or epoxy bonding on Micron2/Datacon EVO tool platform.
• Wafer fab or Assembly shop floor control systems
• Process engineering statistics background (SPC, DOE)
• Experience with Failure Analysis
• Material and Tool selection
• Plasma cleaning equipment and process
• Troubleshooting and resolving equipment problems
• Hands-on data analysis with JMP, MATLAB, or similar packages
• Experience in mentorship and training of operators, engineering technicians, and junior engineers
• Ability to work closely and coordinate activities with other functional groups.
• Good communication and project management skills
• Safety and quality-oriented mindset
• Knowledge & Experience Bachelor's degree in electrical, Mechanical, Materials Engineering, or related field, plus 8 years of related experience, or master's degree with 5 years of experience in semiconductor packaging & assembly technology in a manufacturing environment.

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Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.