Sr. Staff Engineer, Signal-Integrity and Power-Integrity

SK hynix America; San Jose (CA); On-site; USD 165,000 - 220,000; Full time

Benefits offered by this job

Top-tier health insurance

Paid time off

401k matching

FSA

Educational reimbursement

Donation matching

Free meals

Job summary

SK hynix America is seeking a skilled SIPI Engineer to drive the analysis and validation of advanced System-in-Package solutions for memory technologies, including HBMs and interposer-based designs. You will lead SIPI methodology, collaborate with global R&D teams, and shape packaging strategies for 2.5D/3D integration.

The role demands deep knowledge of high-speed interfaces, power delivery networks, and industry standards, with a focus on 2.5D/3D packaging and electrical integrity across

Qualifications

• Master’s degree or higher in Electrical Engineering or related field.
• ≥5 years SIPI analysis experience in advanced packaging.
• Experience with 2.5D/3D architectures, HBM, interposers, and TSV.

Responsibilities

• Define and drive the SIPI roadmap for advanced packaging families.
• Lead development of high-performance SiP architectures (HBM, interposer, 3D stacks) and validate power delivery and signal integrity across the full stack—from silicon to substrate.
• Establish and deploy best-practice SIPI methodologies, including electromagnetic extraction, multi-port S-parameter modeling, and power-network analysis tailored for complex 2.5D/3D environments.
• Partner closely with circuit designers, layout teams, process integration, yield engineering, and system architects to ensure seamless translation of design specifications into manufacturable packages.
• Act as a technical resource for junior and peer engineers, fostering expertise in SIPI analysis and design verification while championing knowledge exchange across global teams.

Skills

SIPI analysis

2.5D/3D packaging

HBM interposer

Power integrity

High-speed I/O

Education

Master's degree or higher

Tools

Synopsys 3DICC

Cadence Integrity 3D-IC

Sigrity

HFSS

HSPICE

ADS

Job description

Sr. Staff Engineer, Signal-Integrity and Power-Integrity

San Jose, CA

About SK hynix America:

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations.We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

Work Model: Onsite

Job Summary

SK hynix America is seeking a skilled and motivated Signal‑Integrity and Power‑Integrity (SIPI) Engineer to join our Advanced Packaging (PKG) R&D team. In this role, you will be at the forefront of semiconductor innovation, driving the analysis, and validation of advanced System-in-Package (SiP) solutions for next-generation memory technologies, including High-Bandwidth Memory (HBM), interposer-based architectures, and GPU-integrated systems. This role focuses exclusively on 2.5D/3D packaging innovations, driving electrical integrity and power delivery robustness for cutting‑edge semiconductor platforms. The position requires deep technical understanding in high-speed interface design, collaboration with global R&D teams, and contributions to industry standards for advanced memory packaging.

Job Responsibilities

• Strategic Roadmap Execution: Define and drive the SIPI roadmap for advanced packaging families, ensuring technical strategies align with product specifications and business objectives.
• Architecture & Design Leadership: Lead the development of high-performance SiP architectures (HBM, interposer, 3D stacks) and validate power delivery and signal integrity across the full stack—from silicon to substrate.
• Methodology Development & Implementation: Establish and deploy best-practice SIPI methodologies, including electromagnetic extraction, multi-port S-parameter modeling, and power-network analysis tailored for complex 2.5D/3D environments.
• Cross-Functional Collaboration: Partner closely with circuit designers, layout teams, process integration, yield engineering, and system architects to ensure seamless translation of design specifications into manufacturable packages.
• Knowledge Sharing & Team Growth: Act as a technical resource for junior and peer engineers, fostering expertise in SIPI analysis and design verification while championing knowledge exchange across global teams.

Qualifications and Education Requirements

• Master’s degree or higher in Electrical Engineering, or a related field. Candidates with relevant industry experience are preferred
• Experience: ≥5years of experience in SIPI analysis in advanced semiconductor packaging.
• Technical Expertise: Proven knowledge of 2.5D/3D package architectures, HBM, interposer, TSV, high‑speed I/O standards, and power‑delivery networks.
• Simulation Tools: Proven proficiency with SIPI simulation tools (e.g., Synopsys 3DICC, Cadence Integrity 3D-IC/Sigrity, Ansys AEDT(Q3D, HFSS)/Siwave/RedHawk, HSPICE, Keysight ADS).
• Analytical Skills: Ability to interpret complex simulation data and translate it into actionable engineering recommendations.
• Communication: Excellent verbal and written communication skills; ability to present complex technical concepts to both engineering and executive audiences.

Preferred Skills

• Currently pursuing a PhD's degree in Electrical Engineering or a related field
• Hands‑on experience with 2.5D/3D packaging for HBM, interposers, or GPU-memory integration.
• Expertise in power integrity (PI) for 3D-stacked memory systems, including PDN impedance profiling and IBIS model validation for HBM.
• In‑depth familiarity with industry standards such as PCIe Gen5/Gen6, CXL, UCIe, and JEDEC memory specifications.
• Proficiency in scripting/automation (Python, TCL, SKILL) to create custom analysis flows and improve productivity.
• Experience validating high-speed memory interfaces using oscilloscopes, VNAs, and compliance test platforms specific to 3D packaging.
• History of published technical papers, patents, or conference presentations in advanced packaging or SIPI.
• Top Tier health insurance at no employee cost
• Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
• 401k Matching
• Flexible Spending Account (FSA) for Health Care &Dependent Care
• Educational reimbursement up to $10,000 per year
• Donation Matching and volunteering opportunities
• Free Breakfast/Lunch/Dinner provided to employees

Compensation

Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.

Pay Range

$165,000 - $220,000 USD

SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.

In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:

Voluntary Self-Identification

For government reporting purposes, we ask candidates to respond to the below self-identification survey.Completion of the form is entirely voluntary. Whatever your decision, it will not be considered in the hiringprocess or thereafter. Any information that you do provide will be recorded and maintained in aconfidential file.

As set forth in SK hynix America’s Equal Employment Opportunity policy,we do not discriminate on the basis of any protected group status under any applicable law.

If you believe you belong to any of the categories of protected veterans listed below, please indicate by making the appropriate selection.As a government contractor subject to the Vietnam Era Veterans Readjustment Assistance Act (VEVRAA), we request this information in order to measurethe effectiveness of the outreach and positive recruitment efforts we undertake pursuant to VEVRAA. Classification of protected categoriesis as follows:

A "disabled veteran" is one of the following: a veteran of the U.S. military, ground, naval or air service who is entitled to compensation (or who but for the receipt of military retired pay would