Sr Principal Laser Packaging Engineer

Molex; Fremont (CA); On-site; USD 200,000 - 260,000; Full time

Benefits offered by this job

Medical

Dental

Vision

Paid vacation

Job summary

Molex is seeking a Sr Principal Laser Packaging Engineer to lead advanced optoelectronic packaging, ensuring mechanical design integrity, optical performance, and reliability of laser diodes for high-density optical networks.

You will collaborate with R&D, product design, manufacturing, suppliers, and customers to meet Telcordia reliability requirements, with a focus on manufacturability and long-term performance.

Qualifications

• PhD in Photonics, Mechanical Engineering, Physics, Optics, or related field.
• 10+ years of industry R&D experience with mechanical design of optoelectronic packages.
• Hands-on optical alignment to submicron tolerances and high thermal power density.
• Experience with FE A and stress analysis to manage CTE/optical misalignment.
• Expertise in component qualification to GR-468 and reliability testing.

Responsibilities

• Provide technical leadership to design novel III-V laser diode packaging technologies for Datacenter growth.
• Design packages with TEC, housing, lid, getter, lenses, or gratings.
• Develop submicron alignment and hermetic sealing processes.
• Ensure manufacturable, high-yield assembly flows in collaboration with product/ops teams.
• Support supplier selection, technology maturity assessments, and risk mitigation.

Skills

R&D leadership

Submicron optical alignment

Thermal/mechanical integration

Communication with cross-functional

Education

PhD in Photonics/Physics/Optics/Mechanical Engineering

Tools

FEA software

Statistical analysis tools

GR-468 qualification experience

Job description

Molex is a global leader in the optical industry, renowned for delivering high-performance, field-proven wavelength management solutions. Our expertise spans components, modules, and integrated line-cards, with a strong focus on innovation, miniaturization, and manufacturing automation. Our advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing.

The Sr Principal Laser Packaging Engineer will own the technical leadership for advanced optoelectronic packages (e.g., CPO, ELSFP). This role is responsible for component design and selection, performance optimization, and long-term reliability assurance of laser diodes and components embedded within advanced optoelectronic packages. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.

What You Will Do

• Provide technical leadership and creativity to design novel III-V laser diode packaging technologies to support Datacenter growth
• Design packages that includes components (e.g., TEC, housing, lid, getter, fiber lens or discrete lenses, gratings)
• Develop processes that includes submicron alignment (x, y, z, f), solder attach of components (e.g., laser diode, ceramic mounts, TEC, etc.) and hermetic lid sealing
• Partner with product and operation teams to ensure designs are compatible with manufacturable, high-yield assembly flows
• Support sub-component supplier selection and evaluation, including technology maturity assessments for robust supply chain
• Support supplier improvement through audits, quality improvement plans, and risk-mitigation initiatives
• Define and oversee component pre-qualification and qualification strategies, including GR-468 Telcordia compliance
• Support failure analysis investigations and corrective actions for product related failures and manufacturing issues, working with internal teams, suppliers, and customers
• Work intimately with laser diode experts to create optimized designs

Who You Are (Basic Qualifications)

• PhD in Photonics, Mechanical Engineering, Physics, Optics, or a closely related field
• At least 10 years of industry R&D experience with mechanical design of optoelectronic packages developed and transferred to manufacturing environments
• Hands-on experience with optical alignment of components to submicron tolerances, designing for high thermal power density
• Experience with mechanical design layout with finite element analysis (FEA) understanding (e.g., to calculate stress/design from CTE mismatch, optic misalignment, thermal limits etc.)
• Experience with various optical components (e.g., gratings, mirrors, lenses), stable attachment methods (e.g., epoxy and solder based)
• Expertise in component qualification methodologies (e.g., GR-468), product reliability testing, and statistical analysis tools
• Experience with component and optical-packaging failure modes, with a demonstrated track record in failure mode analysis and resolution
• Experience with New Product Introduction (NPI) methodology: design, verification, qualification, release to manufacturing
• Strong communication skills with suppliers, customers, and cross-functional internal teams

What Will Put You Ahead

• CFD experience

For this role, we anticipate paying $200,000- $260,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.

Hiring Philosophy

All Koch companies value diversity of thought, perspectives, aptitudes, experiences, and backgrounds. We are Military Ready and Second Chance employers. Learn more about our hiring philosophy here.

Who We Are

At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.

Our Benefits

Our goal is for each employee, and their families, to live fulfilling and healthy lives. We provide essential resources and support to build and maintain physical, financial, and emotional strength - focusing on overall wellbeing so you can focus on what matters most.

• medical
• dental
• vision
• flexible spending and health savings accounts
• life insurance
• ADD
• disability
• retirement
• paid vacation/time off
• educational assistance
• infertility assistance
• paid parental leave
• adoption assistance

Specific eligibility criteria is set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region. If you have questions on what benefits apply to you, please speak to your recruiter.

Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.

Equal Opportunities

Equal Opportunity Employer, including disability and protected veteran status. Except where prohibited by state law, some offers of employment are conditioned upon successfully passing a drug test. This employer uses E-Verify.