Turn this role into an interview — a resume and cover letter built around what this employer wants.
Pierce Manufacturing is looking for a Sr. Principal Embedded Software Engineer in Greenville, WI. This fully onsite role involves designing embedded software for connected vehicle IoT solutions and hands-on testing of large vocational vehicles.
The ideal candidate will have a Bachelor’s degree in a relevant field and over 8 years of experience with embedded software development using C and C++. Strong leadership skills and collaboration with cross-functional teams are essential.
The pay range is between $104,100 and $173,900 annually, reflecting a commitment to competitive compensation.
About Pierce, An Oshkosh Company
Ready to shape the future of Connected Vehicle IoT solutions for mission critical equipment that help everyday heroes? If you are passionate about building a better world through innovative technology, thrive on technical challenges, and are excited to build next generation connected vehicle embedded solutions, we invite you to join us as an Sr. Principal Embedded Software Engineer.
This is a fully onsite role in Greenville, WI. Remote and hybrid arrangements are not available for this position. You must be willing to perform hands‑on testing, troubleshooting, and validation on large vocational vehicles.
Pay Range: $104,100.00 – $173,900.00
Oshkosh is committed to providing reasonable accommodations to job applicants with disabilities. If you need assistance or an accommodation during any part of the employment process, please contact us at corporatetalentacquisition@oshkoshcorp.com.
Oshkosh Corporation is a merit‑based Equal Opportunity Employer. Job opportunities are open for application to all qualified individuals and selection decisions are made without regard to race, color, religion, sex, national origin, age, disability, veteran status, or other protected characteristic. To the extent that information is collected concerning the categories provided by law, it will not affect any employment decision.