Sr.Firmware Developer - OpenBMC

Tessolve; Dallas (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

Tessolve Semiconductors in Dallas, TX is seeking a Sr. Firmware Engineer to design, implement, and validate firmware for OBMF-ICP protocol stack and related components across USB and MCTP transports.

You will lead hardware bring-up, collaborate in OCP discussions, and drive cross-layer architecture and verification best practices. 6–10 years of embedded experience, OpenBMC preferred, with Zephyr/FreeRTOS, Yocto, and ARM/RISC-V expertise.

Qualifications

• Expert embedded C and strong C++.
• BMC / platform-management firmware experience (OpenBMC strongly preferred).
• DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM.
• Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD.
• RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V.
• Yocto/BitBake, CMake/Meson, Git, CI.
• Understanding of I2C/SMBus, SPI, UART, USB, GPIO

Responsibilities

• OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
• Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
• Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
• OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
• Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.

Skills

Embedded C

C++

RTOS (Zephyr/FreeRTOS)

Tools

Yocto/BitBake

CMake/Meson

Git

CI

DMTF MCTP

PLDM

Job description

One of our valued customer is looking for a Sr.Firmware Developer for a longterm contract at DallasTX.

Here is the JD for your reference:

Sr. Firmware Engineer

• OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
• Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
• Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
• OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
• Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.

6 to 10 years of experience

• Expert embedded C, strong C++
• BMC / platform-management firmware experience (OpenBMC strongly preferred)
• DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
• Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
• RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
• Yocto/BitBake, CMake/Meson, Git, CI
• Understanding of I2C/SMBus, SPI, UART, USB, GPIO

Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics.

About us:

Tessolve Semiconductors, a venture of Hero Electronix, is a Design and Test Engineering Service Company providing End to End Solutions from Product Engineering, Software, Hardware, Wireless, Automotive and Embedded Solutions. Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, spec to the product. With 2500+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose. Tessolve offers a highly competitive compensation and benefits along with an electric work environment to scale one’s intellect, skills and growth.