Sr. Field Service Engineer

RAJE Technology, LLC; Mesa (AZ); On-site; USD 110,000 - 150,000; Full time

Job summary

Plasma-Therm seeks a Senior Field Service Engineer IV to lead on-site service for advanced semiconductor capital equipment at a Phoenix-area facility. The role covers wet processing, wet etch platforms, and Plasma-Therm dry systems, with heavy focus on installation, startup, and rapid issue resolution.

The candidate will train at the partner facility in Taiwan, then collaborate with factory engineering teams and domestic headquarters to ensure fast time-to-first-wafer and maintain strict safety

Qualifications

• 8+ years of field service or equipment engineering experience in semiconductor capital equipment manufacturing or advanced wafer fabs.
• Degree in Electrical/Mechanical Engineering, Mechatronics, Semiconductor Technology, or equivalent training/experience.

Responsibilities

• Overseas OEM Training & Product Bring-Up including factory training in Taiwan and site integration in Phoenix.
• Lead on-site tool uncrating, rigging supervision, and system power-on for new tool deliveries.
• Perform PM and corrective maintenance across wet etch and plasma platforms under SLA.
• Lead root-cause failure analysis for chemical delivery, fluidics, and vacuum systems.
• Interface with customer fab engineers and maintain installation schedules.

Skills

Field service leadership

Customer-facing

On-site installation

Troubleshooting

Education

Associate’s or Bachelor’s degree in Electrical/Mechanical Engineering, Mechatronics, Semiconductor Technology, or equivalent

Tools

Jira

Confluence

ERP platforms

Job description

About this position

Plasma-Therm is a leading provider of advanced processing equipment and solutions, specializing in semiconductor manufacturing.

Shift / Travel

Local Fab Support (Phoenix, AZ Area) with On-Call Rotation & Limited Overseas/Domestic Travel

Position Overview

The Senior Field Service Engineer IV (FSE IV) serves as a lead technical expert responsible for tool installation, startup, advanced troubleshooting, preventive maintenance, and modifications for advanced semiconductor capital equipment. In this high-visibility role supporting our Strategic OEM Partnership, the FSE IV will provide critical on-site support at a leading-edge semiconductor manufacturing facility in Arizona across both strategic partner wet processing product lines (Wet Etch / Clean platforms) and Plasma-Therm plasma processing equipment (e.g., PECVD and Dry Etch systems).

The ideal candidate brings deep technical expertise in chemical dispense delivery, wet processing mechanics, fluidics, high-purity piping, process temperature control, vacuum systems, and robotics, along with strong customer-facing leadership skills to manage complex fab escalations.

Key Responsibilities

1. Overseas OEM Training & Product Bring-Up

• Complete intensive, hands‑on factory training at the strategic partner’s manufacturing facility in Taiwan on new pre‑release wet processing/wet etch platforms.
• Work directly with factory development engineers during sub‑assembly, software configuration, and initial tool integration.
• Help capture, review, and refine initial standard operating procedures (SOPs), maintenance protocols, and commissioning checklists for field deployment.
• Lead and oversee on‑site tool uncrating, rigging supervision, facility chemical/utility hookup verification, and system power‑on for new tool deliveries in Phoenix.
• Execute pre‑commissioning checks, sensor calibrations, fluid delivery testing, and Site Acceptance Testing (SAT) to achieve fast time‑to‑first‑wafer.
• Interface directly with customer fab engineers, facility chemical engineering teams, and rigging contractors to maintain installation schedules.

3. Advanced Technical Troubleshooting & Dual-Platform Support

• Perform routine preventive maintenance (PM) and unscheduled corrective maintenance across both wet etch systems and Plasma‑Therm dry processing platforms under strict SLA guidelines (<2 hour response target).
• Lead root‑cause failure analysis for complex chemical delivery, fluidic valves, heater control, robotic wafer transfer, vacuum, and electromechanical escalations.
• Author and drive 8D Quality/Failure Reports to closure in collaboration with factory engineering teams in Taiwan and domestic headquarters.
• Serve as the primary technical point of contact during critical tool‑down scenarios, conducting daily technical updates with customer fab management.
• Ensure strict adherence to customer safety (EHS), cleanroom, chemical handling, and Lockout/Tagout (LOTO) protocols.
• Mentor and train peer engineers, supporting the development of internal SOPs and training logs.

Required Qualifications & Experience

• Education: Associate’s or Bachelor’s degree in Electrical/Mechanical Engineering, Mechatronics, Semiconductor Technology, or equivalent military technical training/experience.
• Experience: 8+ years of direct field service or equipment engineering experience in semiconductor capital equipment manufacturing or advanced wafer fabs.

Technical Skills

• Wet Processing / Wet Etch Expertise: Deep knowledge of liquid chemical delivery systems, high‑purity chemical plumbing/valves (PFA/PVDF), dosing pumps, chemical inline heating/chilling, bath recirculation, flow meters, and liquid filtration.
• Dry / Vacuum Systems: Proficiency with vacuum systems (turbomolecular & dry pumps, vacuum gauging) and electromechanical assemblies.
• Hands‑on experience reading complex electrical schematics, Piping & Instrumentation Diagrams (P&ID), fluidic schematics, and software diagnostic logs.
• Strong working knowledge of cleanroom safety protocols, hazardous chemical handling (acids, bases, solvents), chemical spill protocols, and LOTO procedures.

Soft Skills

• Exceptional written and verbal communication skills for customer escalation management.
• Strong problem‑solving mindset using structured problem‑solving methodologies (e.g., 8D, 5 Whys).
• Ability to work independently in a fast‑paced fab environment and handle high‑pressure customer situations.

Preferred Qualifications

• Prior experience with Plasma‑Therm equipment (e.g., Kobus PECVD, plasma etch, PVD, Evaporator systems).
• Prior experience working within high‑volume 300mm wafer fabrication facilities.
• Familiarity with enterprise tracking tools (e.g., Jira, Confluence, ERP platforms) for tracking service cases, tool serial numbers, and field actions.

Work Environment & Physical Requirements

• Must be able to work inside a Class 10/100 semiconductor cleanroom environment requiring full bunny suit protocol.
• Must be able to lift up to 50 lbs, bend, stoop, and stand for extended periods.
• Flexibility to work varied shifts, including weekend coverage or emergency on‑call rotations as customer demand dictates.