Sr. Director Analog/RF/Mixed Signal IC Design & Development

RiseMe; United States; On-site; USD 230,000 - 330,000; Full time

Job summary

RiseMe seeks a Senior Director to lead our SiGe Analog/RF/Mixed-Signal ASIC development team. This role requires strategic leadership and deep technical expertise in high-frequency, low-noise broadband analog/RF circuit design, including TX, RX, and supporting circuits.

You will guide product development from definition through design and production in a fast-paced environment, mentor a diverse team, and collaborate across functions to deliver cutting-edge solutions for Nokia’s optical engine

Qualifications

• Master's or Ph.D. in Electrical Engineering with at least 15 years in analog/RF ASIC design and leadership.
• Proven track record leading analog/RF/mixed-signal SiGe BiCMOS/CMOS ICs to first-pass productization.
• Experience building and guiding diverse technical teams in fast-paced environments.

Responsibilities

• Lead and mentor the Analog/RF ASIC Design Team through product definition, architecture, design, and test.
• Strategically scale the team to deliver high-performance Analog/RF ASIC solutions for optical engine development.
• Enforce robust design methodologies and processes for quality and reliability.
• Drive selection of circuit topologies to achieve market-leading performance.
• Collaborate with cross-functional teams to define requirements and roadmaps.
• Lead interactions with foundries, packaging, test, and qualification.
• Oversee full IC/chip lifecycle from spec to tape-out, bring-up, test, and reliability.
• Work with verification, CAD, product, and test teams on DVT plans.

Skills

Leadership

Cross-functional leadership

Strategic thinking

Problem-solving

Communication skills

Education

Master's or Ph.D. in Electrical Engineering

Tools

3D EM simulation tools

Job description

We are seeking a highly accomplished Senior Director to lead our SiGe Analog/RF/Mixed-Signal ASIC development team.

This role requires demonstrated strategic leadership in managing complex projects and a deep technical expertise in high-performance, high-frequency, and low-noise broadband analog & RF circuit/chip design, including TX (MZMD), RX (TIA), and supporting circuits.

The ideal candidate will possess extensive experience in leading diverse technical teams, fostering innovation, and driving product development from definition through design and production in a fast-paced environment.

Responsibilities

• Lead and mentor the Analog/RF ASIC Design Team, overseeing product definition, chip architecture, design, foundry selection/interactions, test, and productization.

• Strategically manage and scale the team to deliver cutting-edge Analog/RF ASIC solutions crucial for Nokia’s optical engine development.

• Implement and enforce robust design methodologies and processes to ensure the highest product quality and reliability.

• Drive the exploration and selection of optimal circuit topologies to achieve market-leading product performance.

• Collaborate with cross-functional teams to define comprehensive product requirements and development roadmaps.

• Lead interactions with internal and external partners on foundry processes, packaging, test, and qualification efforts.

• Oversee the complete IC/Chip product development lifecycle, including specification, design, layout, tape-out, silicon bring-up, test, and reliability.

• Partner closely with verification, CAD, product, and test engineering teams to devise and execute comprehensive DVT plans and characterization.

Qualifications

• Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 15 years of progressive experience in Analog/RF ASIC design and leadership.
• Proven track record of analog/RF/mixed-signal SiGe BICMOS, CMOS ICsfirst-pass success in design leading to productization.

• Demonstrated experience in leading and developing high-performing, diverse technical teams.

• Extensive knowledge in high-speed, high-performance, low-noise Analog/RF circuitry.

• Strong understanding of Analog/RF/mixed signal layout techniques and best practices.

• Solid understanding of 3D EM simulation tools.

• Knowledge of RF wafer probing, lab equipment, and evaluation of high-speed analog ICs.

• Strong understanding of package and board-level design optimization.

• Fluent in verbal and written communications.

• Demonstrated ability to independently resolve complex organizational and technical challenges.

• Highly self-motivated, detail-oriented, and results-driven.

• Strategic cross-functional leadership.

• Strategic thinking and business acumen related to product roadmaps and market trends.

• Strong problem-solving and decision-making capabilities.