Sort Probe Card Module Engineer

100 Intel Corporation; Rio Rancho (NM); On-site; USD 104,000 - 146,000; Full time

Job summary

Intel Corporation in Albuquerque, NM seeks a Sort Probe Card Module Engineer to optimize XIU metrology equipment, implement process improvements and support NPIs in high-volume semiconductor manufacturing.

The role involves root-cause analysis, collaboration with Technology Development teams, and training technicians while ensuring safety, quality and manufacturability across projects.

Qualifications

• Experience with statistical process control methodologies and engineering analysis tools.
• Strong problem-solving skills including MBPS, DOE, and FMEA approaches.
• Excellent communication, teamwork and ability to influence decisions.

Responsibilities

• Own and optimize XIU/metrology equipment performance, preventive maintenance and data-driven improvements.
• Drive PCM-related improvements in safety, quality, yield and cost.
• Develop and optimize XIU metrology recipes for NPIs and existing processes.
• Collaborate with TD teams to transfer new processes and probe tech.
• Perform root-cause analysis and implement corrective actions with cross-functional teams.
• Provide training and mentorship to technicians, ensuring customer-oriented manufacturing support.

Skills

SPC

Root-cause analysis

Data analysis

Cross-functional collaboration

Education

B.S./B.E. in Electrical/Mechanical/Chemical Eng

M.S. in Electrical/Mechanical/Chemical Eng

PhD in Electrical/Mechanical/Chemical Eng

Job description

Job Details: Job Description

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

As a Sort Probe Card Module Engineer within the NM DS Probe Card Metrology (PCM) team, you will play an essential role in ensuring the efficiency and reliability of high-volume manufacturing equipment and processes that support Intel's advanced semiconductor production. You will be responsible for monitoring, maintaining, troubleshooting, and optimizing Sort Interface Unit (XIU) and metrology equipment to meet quality, safety, and operational goals while contributing to the development and implementation of innovative process solutions. Your work will directly impact Intel's ability to deliver cutting-edge technologies at scale and support both current and future semiconductor manufacturing needs. This position offers an opportunity to contribute to Intel's foundry and Advanced Packaging success while driving innovation, process improvements, and operational excellence.

Key Responsibilities

• Own and optimize Sort Interface Unit (XIU) and metrology equipment performance, including advanced troubleshooting, preventive maintenance and repair improvements, process monitoring, data analysis, and excursion response.
• Drive PCM‑related improvements in safety, quality, equipment availability, yield, cost, standardization, process control and manufacturability.
• Develop, implement, and optimize XIU metrology recipes for new product introductions (NPIs) and existing production processes.
• Partner with Technology Development (TD) teams to transfer and optimize new processes and probe technologies.
• Explore and develop improved XIU repair and measurement methodologies to support new and emerging probe technologies.
• Perform root‑cause analysis and implement corrective actions for integrated processing issues in collaboration with other modules, upstream and downstream partners, and cross‑functional engineering teams.
• Collaborate with Virtual Factory (VF) partners to drive and implement global process and operational improvements.
• Provide training, mentoring, and coaching to technicians while maintaining a customer‑oriented approach to manufacturing support and promoting innovation and collaboration.
• Oversee the installation, qualification and maintenance of new and existing equipment during factory ramps.
• Develop and maintain strong partnerships with internal teams and external probe card and metrology equipment vendors and developers.

Desired Skills and Behavioral Traits

• Demonstrated experience with statistical process control methodologies and engineering analysis tools.
• Proficiency in model‑based problem‑solving and root‑cause analysis methodologies, including MBPS, DOE, FMEA or equivalent approaches.
• Strong verbal and written communication skills, with the ability to influence peers and managers and communicate complex technical information clearly and concisely.
• Demonstrated disciplined execution, sound judgement, and the ability to act with an appropriate level of urgency.
• Results‑oriented, organized, resourceful and self‑directed, with the ability to demonstrate initiative and work independently.
• Strong attention to quality and detail, with the ability to maintain high standards in manufacturing operations.
• Ability to adapt to new and frequently changing challenges in a high‑volume manufacturing environment.
• Ability to manage multiple priorities across process engineering, equipment sustaining, continuous improvement, process transfer and virtual factory activities.
• Ability to work effectively within and across organizations, including leading and participating in cross‑functional team efforts.
• Demonstrated ability to develop, qualify and implement process and/or hardware improvements.
• Ability to successfully plan, develop and execute projects lasting two or more months.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimal requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor’s degree in Electrical, Mechanical or Chemical Engineering, Materials Science or a related technical discipline with 3+ years of semiconductor device fabrication or semiconductor manufacturing experience.
• Master’s degree in Electrical, Mechanical or Chemical Engineering, Materials Science or a related technical discipline with 2+ years of semiconductor device fabrication or semiconductor manufacturing experience.
• PhD in Electrical, Mechanical or Chemical Engineering, Materials Science or a related technical discipline with 2+ years of semiconductor device fabrication or semiconductor manufacturing experience.

Preferred Qualifications

• Data fluency, including data extraction, visualisation, statistical analysis and interpretation for decision‑making.
• Experience supporting and leading cross‑functional task forces as a facilitator or technical lead.
• Previous PCM or other Sort/Test experience.
• Experience working in high‑volume manufacturing or technology development environments.
• Strong collaboration and communication skills with cross‑functional teams and external suppliers.

Requirements

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, New Mexico, Albuquerque

Additional Locations

None listed

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses and benefit programmes which include health, retirement and vacation.

Annual Salary Range for jobs which could be performed in the US: $103,730.00-146,440.00 USD.

Work Model for this Role

This role will require an on‑site presence.