Software and Engineering Intern Roles - Imaging and Print

Hewlett Packard Enterprise; Corvallis (OR); On-site; USD 40,000 - 48,000; Full time

Benefits offered by this job

Health insurance

Dental insurance

Vision insurance

Disability insurance

Employee assistance program

Flexible spending account

Paid time off

Job summary

Hewlett Packard Enterprise invites students to join a 12-week paid summer internship within the HP Imaging, Printing & Solutions group. You will contribute to quality engineering, testing, and data analysis while collaborating with mechanical, electrical, firmware, and software teams.

Eligible candidates are in the 3rd year of university or early masters, with strong analytical and presentation skills. The program emphasizes real ownership, mentorship, and potential conversion to full-time roles

Qualifications

• 3rd year of university completed or 1st year of Masters completed—technical degree focus.
• Able to obtain work authorization in the United States in 2027 and not require sponsorship in the future.
• Has no more than 24 months of prior work experience professionally related to the intern requisition.

Skills

Quality Assurance

Root Cause Analysis

Testing

Data Analysis

Excel

Public Speaking

Cross-functional Collaboration

Excel PowerPoint

Learning agility

Education

3rd year of university or 1st year of masters completed

Tools

JMP

Minitab

SolidWorks

Creo/ProEngineer

AutoCAD

MATLAB

Python

Git

MS PowerPoint

MS Excel

Job description

About Us

Innovation is in HP’s DNA. From our origins in a Palo Alto garage in 1939, to our current position as one of the world’s leading technology companies, HP has grown to become a leader in technology and corporate culture, inspiring innovators, and entrepreneurs around the global. HP brings together a portfolio that spans printing, personal computing, software, and services to serve more than 1 billion customers in over 170 countries. We are committed to fostering a diverse and inclusive workplace that attracts exceptional talent and to supporting our employees to succeed at all levels. We dream in over 35 languages and share one mission: to engineer experiences that amaze.

The Program

Our intern program is intended to enhance your overall learning experience, give you an opportunity to make an impact, have some fun, and meet great people along the way. Join us for a 12-week paid summer internship designed to let you apply your classroom learnings to real world challenges. Our internships have a thoughtful balance of networking, executive speakers, community involvement, big projects with no paper filing, and fun!

Team

HP Imaging, Printing & Solutions (IPS) is focused on shaping the future of print through a portfolio of consumer, commercial, and industrial printing solutions. By combining industry-leading devices, supplies, software, and services, IPS delivers secure, sustainable, and digitally enabled experiences that empower customers to be more productive, creative, and connected.

Areas of Interest

• Quality Engineering: Quality Assurance, Root Cause Analysis, Testing, Process Improvement, Data Analysis, Excel, Product reliability, Validation, characterization and experimental testing, JMP Statistical Software and Minitab, Ability to document findings and provide engineering recommendations
• Mechanical Engineering: CAD, 3D Modeling, Mechanical Design, Prototyping, Materials, Engineering Analysis, Fluidics and ink-delivery systems, Print-system design and print quality, SolidWorks, Creo/ProEngineer and AutoCAD
• Electrical Engineering: Circuit Design, Electronics, PCB Design, Electrical Testing, MATLAB, Python
• Hardware Engineering: Hardware Design, Circuit Analysis, PCB Development, Hardware Testing, Debugging, Electronics, Industrial controls, including Siemens and B&R, Visual Studio, C# and hardware controls
• System integration and lifecycle validation
• Embedded Systems / Development: C/C++, Python, Microcontrollers, Firmware, Embedded Systems, Debugging, Git
• Software Development: Python, Java, C/C++, JavaScript, Git, Software Testing, Data Structures
• Systems Engineering: System Design, Requirements Analysis, Integration, Testing, Troubleshooting, Technical Documentation
• Manufacturing Engineering: Manufacturing Processes, Process Improvement, Automation, Quality, CAD, Data Analysis
• Test Engineering: Software/Hardware Testing, Test Automation, Debugging, Troubleshooting, Python, Data Analysis
• Firmware Engineering: C/C++, Embedded Systems, Microcontrollers, Firmware Development, Debugging, Git
• Data Science / Analytics: Python, SQL, Data Analysis, Statistics, Machine Learning, Excel

Education and Experience Required

3rd Year of University completed or 1st year of Masters completed--typically a technical degree specialization. Has no more than 24 months of prior work experience professionally related to the intern requisition they are applying to (not including internships, teaching assistance, research work, or military experience). Able to obtain work authorization in the United States in 2027, and not require sponsorship in the future.

Preferred Majors/Programs

• Computer Science
• Electrical Engineering
• Mechanical Engineering
• Computer Engineering
• Chemical Engineering
• Materials Science
• Mechatronics Engineering
• Artificial Intelligence/Data Science

Preferred Knowledge and Skills

• Project experience demonstrating strong analytical, modeling and research skills
• Strong executive-level presentation skills (storyboarding, development, and delivery)
• Demonstrable success in delivering results in a cross-functional team setting
• Ability to handle ambiguity and unstructured work situations
• Team player who supports others and leads executives and peers through logical reasoning and relationship development
• Strong public speaking and workshop/conversation-facilitation skills
• Demonstrated ability to shape and influence ideas and actions of others
• Working knowledge of MS PowerPoint and MS Excel
• Ability to plan experiments, analyze data, and document technical findings
• Strong problem-solving and troubleshooting skills
• Attention to detail and commitment to quality and reliability
• Ability to learn and apply new engineering tools and technologies
• Interest in collaborating across mechanical, electrical, firmware, manufacturing, and data disciplines

Eligibility

Qualified applicants will be contacted in concert with the approval and publication of identical, approved positions within HP, Inc. This opportunity is intended for conversion to a full-time role that will not offer work authorization sponsorship in the future (full-time conversion pending performance evaluation post internship and available headcount). Interested candidates must be currently eligible to work in the US AND must not require work authorization sponsorship in the future. HP, Inc. will not provide any assistance or sign documentation in support of immigration sponsorship including Curricular Practical Training (CPT) or Optional Practical Training (OPT).

Contract and Schedule

Administration Schedule - Full time Shift - No shift premium (United States of America)

Travel - Relocation

Salary

The pay range for this position is $29 to $35 per hour (applies to US candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including; 4-12 weeks fully paid parental leave based on tenure
• 13 paid holidays
• 15 days paid time off (US benefits overview)

Equal Opportunity Employer

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence. For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal".