Silicon Packaging Design Architect

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 164,000 - 312,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in the United States (Arizona, Phoenix) is seeking a Silicon Packaging Design Architect to lead end-to-end package solutions across electrical, mechanical, and thermal requirements. You will collaborate with silicon, hardware, and package teams to translate requirements into robust architectures, guide tradeoffs, and ensure high-quality production handoff.

The role emphasizes innovation in advanced packaging technologies and working with EDA partners to optimize cost and

Qualifications

• 2+ years of hands-on experience in semiconductor fabrication, chip assembly, or packaging.
• Experience with electromagnetic simulation tools such as Mentor, Cadence, SPICE, Ansys.
• Experience with Cadence Allegro and/or Mentor Xpedition tools.
• In-depth knowledge of assembly processes, test methodologies, and characterization techniques.

Responsibilities

• Translate product requirements into detailed package architecture specifications.
• Drive technology tradeoff decisions to ensure silicon packages conform to electrical, mechanical, thermal, and reliability standards.
• Collaborate with silicon, hardware, and package teams to deliver high-quality package solutions and overcome roadblocks.
• Oversee the end-to-end package development process, including design, procedures, and continuous improvements to quality standards.
• Troubleshoot packaging designs and resolve issues related to materials and processes, providing innovative and cost-effective solutions.
• Implement co-design strategies between silicon and board design teams to optimize product performance and cost.
• Collaborate with EDA partners to advance package design tools and optimize design methods.

Skills

EM simulation

Cross-functional collaboration

Analytical thinking

Education

Bachelor's degree in EE/ME/Materials Science or STEM with 6+ years

Master's degree in EE/ME/Materials Science with 4+ years

Ph.D. in EE/ME/Materials Science with 2+ years

Tools

Cadence Allegro

Mentor Xpedition

PCB Editor

Sigrity

Hyperlynx

SPICE

Ansys

Job description

## Silicon Packaging Design ArchitectApply: US, Arizona, Phoenix: Full time: Posted Today: JR0287473# **Job Details:**## Job Description:**The Role and Impact** We are seeking a Silicon Packaging Design Architect to join our team, where you will drive end-to-end package solutions for physical, electrical, and cost requirements. In this senior engineering role, you will collaborate with cross-functional teams to design, troubleshoot, and continuously improve packaging standards and processes, ensuring high-quality package output. Your contributions will directly impact the seamless transition of designs to production and enhance Intel's advanced packaging technologies. **Business Group** As part of Intel Corporation's dynamic and innovative ecosystem, this role resides within the Silicon Packaging Architecture team, focused on developing advanced packaging solutions that enable Intel's cutting-edge silicon technologies. The team plays a vital role in ensuring packaging, and 3D IC designs meet technical, mechanical, and reliability standards while supporting Intel's broader mission to drive world-changing advancements in technology. **Key Responsibilities*** Translate product requirements into detailed package architecture specifications.* Drive technology tradeoff decisions to ensure silicon packages conform to electrical, mechanical, thermal, and reliability standards.* Collaborate with silicon, hardware, and package teams to deliver high-quality package solutions and overcome roadblocks.* Oversee the end-to-end package development process, including design, procedures, and continuous improvements to quality standards.* Troubleshoot packaging designs and resolve issues related to materials and processes, providing innovative and cost-effective solutions.* Implement co-design strategies between silicon and board design teams to optimize product performance and cost.* Collaborate with EDA partners to advance package design tools and optimize design methods. **Core Competencies*** Strong analytical, communication, and organizational skills.* Proven ability to manage multiple priorities and deadlines in a dynamic environment.## **Qualifications:**The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.**Minimum Qualifications*** **Option 1:** Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science or in a STEM related role with 6+ years of experience.* **Option 2:** Master's degree in electrical engineering, mechanical engineering, chemical engineering, materials science or in a STEM related role with 4+ years of experience.* **Option 3:** Ph.D. in electrical engineering, mechanical engineering, chemical engineering, materials science or in a STEM related role with 2+ years of experience.* 2+ years of hands-on experience in semiconductor fabrication, chip assembly, or packaging.* Experience in electromagnetic simulation tools such as Mentor, Cadence tools, SPICE, Ansys tools, or similar platforms.* Experience with Cadence Allegro platform tools (e.g. PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity) and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).* In-depth knowledge of assembly processes, test methodologies, and characterization techniques.**Preferred Qualifications*** 10+ years of experience with profound knowledge in Package, PCB design, or IC digital design.* Experience in troubleshooting and optimizing packaging designs for cost and quality.* Strong analytical and problem-solving skills, including the ability to identify, isolate, and resolve complex design issues.* Experience in semiconductor fabrication and packaging processes.* Proven ability to collaborate with multidisciplinary teams across various levels of abstraction.* Familiarity with technology trade-off decisions to ensure high-quality package outputs.We look forward to welcoming innovative thinkers who are passionate about shaping the future of technology. Apply today to make an impact and join Intel's journey toward groundbreaking advancements.## Job Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $164,470.00-311,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \\* Job posting details (such as work model, location or time type) are subject to change.