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An established industry player is seeking a talented engineer to join their innovative Global CAD team. This role focuses on enhancing Signoff solutions for Snapdragon chips, which power billions of mobile devices. You'll leverage your expertise in Signoff Timing and spice simulation to collaborate closely with various teams, driving advancements in methodologies and tools. If you have a passion for cutting-edge technology and thrive in a dynamic environment, this is the perfect opportunity for you to make a significant impact on the future of mobile computing.
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
Join QCOM Technologies Inc vibrant Global CAD team pushing the limits of Signoff solutions for the Snapdragon chips powering billions of mobile devices. The position requires Signoff Timing and spice simulation experience, with CAD development skills to define and develop tools and methodologies for accuracy, compute, in close collaboration with Snapdragon Physical Design and Timing teams. Qualcomm is using leading edge internal and EDA technologies in the Signoff domain, including pioneering in genAI/ML, and developing good-by-construction hierarchical solution, as well as enabling the latest STA features to reduce conservatism in Signoff.
This role’s responsibilities will include:
Preferred Qualifications:
Principal Duties and Responsibilities:
Minimum Qualifications: