Senior Yield & Integration Engineer - IR Detectors

Teledyne LeCroy Korea

Goleta (CA)

On-site

USD 142,000 - 189,000

Full time

14 days+
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Job summary

Teledyne is seeking a Senior Yield & Integration Engineer to drive yield improvement and defect reduction across IR detector and thermal imaging device manufacturing. You will lead root-cause analyses, coordinate technology transfers, and mentor teams while partnering with design, reliability, and production groups.

The role requires deep analytics, data-driven decision making, and hands-on experience with MEMS/bolometer fabrication and advanced failure analysis.

Qualifications

  • M.S. or equivalent in a STEM field.
  • 7+ years of experience in yield engineering, process integration, or device engineering.
  • Direct experience with infrared detectors, thermal imaging systems, microbolometers, or MEMS devices.
  • Must be US Citizen or PERM Resident.

Responsibilities

  • Oversee wafer foundry yield management and establish yield monitoring.
  • Lead root cause investigations into yield excursions across fabrication, assembly, and test.
  • Drive corrective actions and optimize process windows for yield improvement.
  • Analyze yield loss mechanisms and correlate defects to performance.
  • Own integrated process flows for IR & bolometer tech.
  • Mentor junior engineers and lead Lean/Six Sigma improvement projects.

Skills

Technical expertise
MEMS fabrication
Data analytics
Root cause analysis
Lean Six Sigma
Cross-functional leadership
Process integration

Education

M.S. or equivalent in STEM

Tools

JMP
Python
SQL
MATLAB
SEM
EDX
FIB

Job description

Teledyne is seeking a Senior Yield & Integration Engineer to drive yield improvement and defect reduction across IR detector and thermal imaging device manufacturing. You will lead root-cause analyses, coordinate technology transfers, and mentor teams while partnering with design, reliability, and production groups.

The role requires deep analytics, data-driven decision making, and hands-on experience with MEMS/bolometer fabrication and advanced failure analysis.

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