Senior Vehicle Integration & Packaging Lead

Waymo; San Francisco (CA); Hybrid; USD 196,000 - 242,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity incentive plan

Company benefits program

Job summary

Waymo is seeking a Mechanical Integration Engineer to drive full-vehicle integration of the Self Driving System from concept through production in a hybrid role reporting to a Design Manager in California.

You will manage interfaces across internal teams and external OEM partners, lead CAD/DMU strategies, and oversee BOM/PLM processes while guiding milestones from virtual models to final hardware. 15% travel required.

Qualifications

• Bachelor's degree in mechanical engineering or related field.
• 8+ years vehicle/transportation experience preferred.
• Strong CAD experience with CATIA or 3DX.
• Experience with BOM management and PLM systems.
• Excellent cross-functional communication.

Responsibilities

• Drive full-vehicle mechanical integration from concept through production.
• Establish mechanical interface requirements and geometric boundaries with internal teams and external OEM partners.
• Align cross-functional milestones with integration roadmaps and verification.
• Lead CAD/DMU strategies and maintain CAD tree organization.
• Manage EBOM structure release and maturation from concept to prototype.
• Support end-to-end vehicle build execution from virtual models to hardware.

Skills

CAD tools proficiency

Cross-functional leadership

Communication skills

BOM/PLM experience

Problem solving

Education

Bachelor's degree in Mechanical Engineering

Tools

CATIA V5/V6 or 3DX

Vis-Mockup

DMU strategies

PLM systems

BOM management tools

Job description

Waymo is seeking a Mechanical Integration Engineer to drive full-vehicle integration of the Self Driving System from concept through production in a hybrid role reporting to a Design Manager in California.

You will manage interfaces across internal teams and external OEM partners, lead CAD/DMU strategies, and oversee BOM/PLM processes while guiding milestones from virtual models to final hardware. 15% travel required.