Senior Thermal Design Engineer - Spacecraft Systems

Arcfield; Louisville (CO); On-site; USD 122,000 - 181,000; Full time

Job summary

Arcfield, through Orion Space Solutions, seeks a seasoned Thermal Engineer to drive thermal design and analysis for spacecraft and payloads. You will work across components, sub-systems, and vehicle levels to close thermal paths while meeting cost and schedule targets.

Responsibilities include FEM-based analysis with Ansys Thermal Desktop, and designing thermal integration for electronic assemblies such as processors and cameras.

Qualifications

• 10–12 years of professional thermal engineering experience with a bachelor’s degree.
• 5+ years in space/aerospace or high-reliability product design.
• Experience with Ansys Thermal Desktop, AutoCAD and DSS SolidWorks.

Responsibilities

• Perform thermal system design and analysis for spacecraft and payloads across component, sub-system, and space vehicle level.
• Design thermal integration of electronic components such as processors, power supplies, cameras, and optical assemblies at the sub-system spacecraft bus and space vehicle level.
• Ensure thermal designs close properly and identify innovative means to meet thermal, cost, and schedule requirements.
• Perform FEM-based thermal model analysis using Ansys Thermal Desktop.
• Develop preliminary concepts supporting early design activities through design V&V and transition to rate production.
• Collaborate effectively across the team and cross-functional disciplines: avionics, mechanical, structural, program management, and AI&T teams with strong internal customer focus.

Skills

Thermal engineering

FEM analysis

Cross-functional collaboration

Education

Bachelor’s degree or higher in relevant engineering/computation field

Master’s degree (MS) in related field

PhD in related field

Tools

Ansys Thermal Desktop

AutoCAD

SolidWorks

Job description

Arcfield, through Orion Space Solutions, seeks a seasoned Thermal Engineer to drive thermal design and analysis for spacecraft and payloads. You will work across components, sub-systems, and vehicle levels to close thermal paths while meeting cost and schedule targets.

Responsibilities include FEM-based analysis with Ansys Thermal Desktop, and designing thermal integration for electronic assemblies such as processors and cameras.