Senior Silicon Photonics Engineer - PIC Tape-Out Lead

Berkner Group; San Francisco (CA); On-site; USD 180,000 - 250,000; Full time

Job summary

Berkner Group is seeking a Principal Silicon Photonics Engineer to own photonic chip design end-to-end—from device design through tape-out, wafer-scale test, and packaging. You will be a technical anchor on a small team, setting design standards and driving tape-outs with foundries.

Based in the Bay Area, you will collaborate with EIC, systems, and research colleagues to shape architecture and roadmap, mentor a growing team, and lead high-speed photonics integration and testing for

Qualifications

• 5–10+ years in photonic integrated circuit design and architecture.
• Hands-on PIC design and full end-to-end tape-out experience.
• Proven ability to lead and mentor a small technical team.

Responsibilities

• Design PICs hands-on—from devices to circuits and validated PIC chips.
• Lead full PIC tape-outs end-to-end with commercial foundries.
• Plan wafer-scale testing and packaging; build test structures.
• Break down photonic systems; debug failure points.
• Drive PIC high-speed EIC integration and co-design.
• Run high-speed photonic simulation and modeling to de-risk designs.
• Set design methodology and mentor a small team.

Skills

PIC design

Tape-out experience

High-speed photonics

Team leadership

Education

MS in Electrical Engineering, Materials Science, or Applied Physics

Tools

Lumerical

Tidy3D

HFSS

Job description

Berkner Group is seeking a Principal Silicon Photonics Engineer to own photonic chip design end-to-end—from device design through tape-out, wafer-scale test, and packaging. You will be a technical anchor on a small team, setting design standards and driving tape-outs with foundries.

Based in the Bay Area, you will collaborate with EIC, systems, and research colleagues to shape architecture and roadmap, mentor a growing team, and lead high-speed photonics integration and testing for