Senior Signal Integrity Engineer — High‑Speed Interconnects

Amphenol Corporation

Yocumtown (PA)

On-site

USD 95,000 - 150,000

Full time

4 days ago

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Job summary

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, seeks a Senior Signal Integrity Engineer in Etters, PA to advance high-speed interconnects for telecom, data center and networking applications.

You will design, simulate, and analyze signal integrity in PCB layouts and connectors, collaborate with cross‑functional teams, and apply advanced measurement techniques to ensure robust performance across multiple platforms.

Qualifications

BS in Electrical Engineering or Physics.
Hands-on experience with frequency-domain and time-domain characterization.
Experience with signal integrity measurements using TDR, VNA, pattern generators and error detectors.
Understanding of electromagnetic principles.
MS/PhD in Electrical Engineering or Physics.
5+ years of industry experience with EM principles for digital SI.
Experience with high-speed connectors in communications equipment is a plus.
Experience with SI measurement tools such as TDR, VNA, pattern generators, error detectors and similar measurement equipment.
Experience with signal integrity and simulation/analysis tools such as Ansys HFSS and Designer, CST Microwave, HSPICE, MatLab, and ADS.

Responsibilities

Assist with providing solutions to customers across a wide range of high-speed data transmission requirements.
Identify and resolve signal integrity issues in PCB layouts and direct layout for customers.
Design, simulation, characterization, and application of high-speed electrical connectors and cable-based interconnect.
Supporting to the internal Sales Engineers to develop strategies for product break-in at existing and new accounts based on signal integrity and electrical engineering expertise
Application of Circuit theory and high-speed digital transmission, PCB layout principles for high-speed digital design
Collaborating on a multi-disciplinary team in the development of next generation high speed backplane interconnect products