Senior RF PCB Designer - High-Speed Multi-Layer (Defense)

Lancesoft; Lansdale (Montgomery County); On-site; USD 117,000 - 124,000; Full time

Job summary

Lancesoft is seeking an experienced Senior PCB Designer with strong RF layout expertise to join our engineering team in a high-stakes environment. The ideal candidate will design complex, high-speed, multi-layer PCBs for mission-critical applications in defense or aerospace, applying RF design principles, SI/PI concepts, and compliance standards.

You will work with Altium Designer, Siemens Xpedition, and Cadence Allegro to deliver robust, manufacturable boards.

Qualifications

• 8+ years of professional PCB design experience.
• Experience with RF layout, controlled impedance, and high-speed routing.
• Familiarity with MIL-STD/ITAR environments and defense/aerospace projects.

Responsibilities

• Design and develop complex, multi-layer PCBs (rigid, flex) for RF/high-speed use.
• Perform RF layout for impedance-controlled structures and high-speed traces.
• Ensure SI/PI, EMI/EMC, and thermal management best practices.
• Collaborate with RF, hardware, mechanical, and manufacturing teams throughout the lifecycle.
• Create fabrication/assembly documentation and PCB libraries.

Skills

RF design

High-speed layout

Mentor Xpedition experience

Altium knowledge

Leadership/mentoring

Education

Associate or bachelor’s degree in electrical engineering

Tools

Siemens Xpedition

Cadence Allegro PCB Designer

HFSS

ADS

IPC CID/CID+ certification

Job description

Lancesoft is seeking an experienced Senior PCB Designer with strong RF layout expertise to join our engineering team in a high-stakes environment. The ideal candidate will design complex, high-speed, multi-layer PCBs for mission-critical applications in defense or aerospace, applying RF design principles, SI/PI concepts, and compliance standards.

You will work with Altium Designer, Siemens Xpedition, and Cadence Allegro to deliver robust, manufacturable boards.