Senior Printed Circuit Board Designer

Lancesoft; Lansdale (Montgomery County); Vor Ort; USD 117.000 - 124.000; Vollzeit

Zusammenfassung

Lancesoft is seeking an experienced Senior PCB Designer with strong RF layout expertise to join our engineering team in a high-stakes environment. The ideal candidate will design complex, high-speed, multi-layer PCBs for mission-critical applications in defense or aerospace, applying RF design principles, SI/PI concepts, and compliance standards.

You will work with Altium Designer, Siemens Xpedition, and Cadence Allegro to deliver robust, manufacturable boards.

Qualifikationen

• 8+ years of professional PCB design experience.
• Experience with RF layout, controlled impedance, and high-speed routing.
• Familiarity with MIL-STD/ITAR environments and defense/aerospace projects.

Aufgaben

• Design and develop complex, multi-layer PCBs (rigid, flex) for RF/high-speed use.
• Perform RF layout for impedance-controlled structures and high-speed traces.
• Ensure SI/PI, EMI/EMC, and thermal management best practices.
• Collaborate with RF, hardware, mechanical, and manufacturing teams throughout the lifecycle.
• Create fabrication/assembly documentation and PCB libraries.

Kenntnisse

RF design

High-speed layout

Mentor Xpedition experience

Altium knowledge

Leadership/mentoring

Ausbildung

Associate or bachelor’s degree in electrical engineering

Tools

Siemens Xpedition

Cadence Allegro PCB Designer

HFSS

ADS

IPC CID/CID+ certification

Jobbeschreibung

Duration: 03+ months (with possible extension).

Shift:1st Shift 7:00-5:00.

Pay Rate: Between $85 to $90/hr. w2.

Prescreening Questions & Answers:

1. Can you walk me through a recent PCB design where you handled RF layout in the GHz range, including how you managed controlled impedance, grounding, and EMI/EMC challenges?

2. Which PCB design tools (Altium, Xpedition, Cadence Allegro) have you used most extensively, and how have you leveraged them on complex, multi-layer RF or high-speed designs?

3. Have you worked on designs requiring IPC standards, MIL-STD compliance, or within ITAR-controlled environments? If so, how did those requirements impact your design and documentation process?

Job Summary:

• We are seeking an experienced Senior PCB Designer with strong RF layout expertise to join our engineering team.
• The ideal candidate will have extensive experience designing complex, high-speed, multi-layer PCBs for mission-critical applications, preferably within the defense or aerospace industry.
• This role requires deep technical knowledge of RF design principles, signal integrity, and industry compliance standards, along with proficiency in Altium Designer, Siemens Xpedition (Mentor), and Cadence Allegro.

Key Responsibilities:

• Design and develop complex, multi-layer PCBs (including rigid, flex, and rigid flex) for RF and high-speed digital applications.
• Perform RF layout for controlled impedance structures, transmission lines, antennas, filters, LNAs, PAs, and mixed-signal designs.
• Implement best practices for signal integrity (SI), power integrity (PI), EMI/EMC mitigation, and thermal management.
• Collaborate closely with RF, hardware, mechanical, and manufacturing engineers throughout the product lifecycle.
• Create and maintain PCB libraries, stack-ups, and design rules.
• Generate fabrication and assembly documentation packages.
• Support prototypes bring-up, testing, and debugging activities.
• Ensure compliance with IPC standards (IPC-2221/2222/6012, etc.) and defense-related requirements.
• Interface with PCB fabricators and CM partners to resolve DFM/DFT issues.
• Participate in design reviews and provide technical leadership/mentorship to junior designers.

Required Qualifications:

• 8+ years of professional PCB design experience.

Strong proficiency in:

• Siemens Xpedition (Mentor Graphics).
• Cadence Allegro PCB Designer.
• Experience with high-layer-count boards (10+ layers preferred).

Deep understanding of:

• Controlled impedance routing.
• Return path management.
• Grounding and shielding strategies.
• Experience working with high-speed interfaces (e.g., SERDES, DDR, PCIe, Ethernet, etc.).
• Familiarity with stack-up design and material selection for RF performance.
• Working knowledge of SI/PI analysis tools.

Preferred Qualifications:

• Experience in the defense, aerospace, or military electronics industry.
• Familiarity with MIL-STD requirements and ITAR-controlled environments.
• Experience designing for harsh environments (temperature, vibration, shock).
• Security clearance (active or eligible).
• Experience with simulation tools (HFSS, ADS, HyperLynx, etc.).
• IPC CID/CID+ certification.

Soft Skills:

• Strong problem-solving and analytical skills.
• Excellent communication and cross-functional collaboration abilities.
• Detail-oriented with strong documentation discipline.
• Ability to manage multiple projects in a fast-paced, regulated environment.
• Leadership mindset with mentoring capability.

Education:

• Associate or bachelor’s degree in electrical engineering, Electronics Technology, or related field (or equivalent experience).