Senior RET & OPC Engineer - Lithography Innovator

Micron Technology, Inc.; Boise (ID); Hybrid; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking an Advanced RET Engineer to develop and optimize RET and OPC solutions, enabling high-fidelity wafer patterning for advanced memory technologies.

You will collaborate with technology development and manufacturing teams to improve reticle solutions and tapeout methodologies. Minimum qualifications include a strong background in lithography, EUV, and patterning techniques, with 6+ years of RET/OPC experience.

Qualifications

• Bachelor's degree in a technical field plus 6+ years in RET/OPC.
• Experience applying RET/OPC for semiconductor patterning.
• Strong understanding of EUV lithography and resist behavior.

Responsibilities

• Develop and implement RET and OPC solutions to improve pattern fidelity, manufacturability, and yield
• Optimize lithography methodologies, software capabilities, and tapeout processes to improve performance and efficiency
• Analyze patterning issues, identify root causes, and drive corrective actions across R&D and manufacturing environments
• Lead complex mask development and lithography optimization projects while collaborating across engineering teams
• Mentor engineers and promote technical best practices, knowledge sharing, and AI-enabled engineering approaches

Skills

RET & OPC knowledge

EUV lithography understanding

Cross-functional collaboration

Problem solving

Education

Bachelor's degree in Electrical Engineering, Materials Science, Physics, or Chemical Engineering

Tools

Sentaurus Litho

ProLith

EDA tools (Synopsys, Siemens, Cadence, Brion)

Job description

Micron Technology, Inc. is seeking an Advanced RET Engineer to develop and optimize RET and OPC solutions, enabling high-fidelity wafer patterning for advanced memory technologies.

You will collaborate with technology development and manufacturing teams to improve reticle solutions and tapeout methodologies. Minimum qualifications include a strong background in lithography, EUV, and patterning techniques, with 6+ years of RET/OPC experience.