Senior RET & OPC Engineer — Lithography & Patterning

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical benefits

Paid time off

Holidays

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking an experienced Resolution Enhancement Techniques (RET) Engineer to develop RET and OPC solutions for high-fidelity wafer patterning in advanced memory technologies.

You will collaborate with R&D and manufacturing teams to improve reticle solutions and tapeout methodologies. Minimum qualifications include a bachelor's degree in a technical field and 6+ years in RET/OPC, with knowledge of EUV lithography and lithography simulation tools.

Qualifications

• BS in a technical field plus 6+ years in RET, OPC, lithography or mask development.
• Experience applying RET/OPC to semiconductor patterning challenges.
• Strong understanding of EUV lithography, optics, and resist behavior.

Responsibilities

• Develop and implement RET and OPC solutions to improve pattern fidelity, manufacturability, and yield.
• Optimize lithography methodologies, software capabilities, and tapeout processes.
• Analyze patterning issues, identify root causes, and drive corrective actions across R&D and manufacturing.
• Lead complex mask development and lithography optimization projects with cross-functional teams.
• Mentor engineers and promote technical best practices and knowledge sharing.

Skills

RET

OPC

Lithography

Mask development

EUV lithography

Patterning analysis

Cross-functional collaboration

Mentoring engineers

Python/ scripting

Education

Bachelor's degree in Electrical Engineering or related field

Master's degree or PhD (Preferred)

Tools

Sentaurus Litho

ProLith

EDA tools (Synopsys, Cadence, Siemens)

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking an experienced Resolution Enhancement Techniques (RET) Engineer to develop RET and OPC solutions for high-fidelity wafer patterning in advanced memory technologies.

You will collaborate with R&D and manufacturing teams to improve reticle solutions and tapeout methodologies. Minimum qualifications include a bachelor's degree in a technical field and 6+ years in RET/OPC, with knowledge of EUV lithography and lithography simulation tools.