Senior Quantum Integration Engineer (PMTS)

GlobalFoundries; United States; On-site; USD 143,000 - 247,000; Full time

Job summary

GlobalFoundries’ Quantum Integration Engineer (PMTS) will serve as a principal technical contributor enabling the company’s quantum computing roadmap and will provide critical integration expertise across multiple technology domains.

The role requires leadership across device integration, BEOL interconnect, photonics integration, cryogenic interfaces, and quantum hardware process development, aligning with manufacturing, model ing, packaging, reliability, and external partners.

Qualifications

• 15+ years of semiconductor process integration, technology development, or advanced manufacturing experience.
• Experience leading cross-functional technical programs.
• Ability to communicate complex technical concepts to engineering and leadership.
• Familiarity with semiconductor integration, BEOL, photonics, and packaging.
• Experience with quantum hardware concepts or cryogenic electronics is a plus.

Responsibilities

• Lead development of semiconductor integration architectures for quantum computing platforms.
• Define integration strategies across front-end devices, BEOL routing, and quantum modules.
• Develop roadmaps for scalable, manufacturable quantum hardware.
• Collaborate with device engineering, manufacturing, reliability, modeling, and packaging teams.
• Mentor junior engineers and contribute to IP disclosures and strategy.

Skills

Analytical skills

Experimental design

Cross-functional leadership

Complex problem solving

Education

Electrical Engineering / Materials Science / Physics or related field

Tools

MES systems

Foundry processing knowledge

Job description

GlobalFoundries’ Quantum Integration Engineer (PMTS) will serve as a principal technical contributor enabling the company’s quantum computing roadmap and will provide critical integration expertise across multiple technology domains.

The role requires leadership across device integration, BEOL interconnect, photonics integration, cryogenic interfaces, and quantum hardware process development, aligning with manufacturing, model ing, packaging, reliability, and external partners.