Senior Process Engineer

Polaris Electro-Optics, Inc.; San Diego (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Polaris Electro-Optics, Inc. in San Diego seeks a Sr Process Engineer to develop and monitor advanced manufacturing processes for opto-electronic products. You will design packaging workflows, lead 2.5D/3D integration, and collaborate across engineering teams.

The role requires hands-on process development experience, strong reliability focus, and startup-speed adaptability. Join a fast-growing photonics company driving cutting-edge data-center solutions.

Qualifications

• 5+ years of hands-on experience in manufacturing processes and process improvements.
• Deep technical expertise in Flip Chip packaging and Thermo-Compression Bonding (TCB).
• Proven understanding of 2.5D and 3D packaging technologies and their unique reliability challenges.
• Experience with statistical analysis methods (DOE, Gage R&R, etc.) and software (JMP, Minitab, etc.).
• Experience with failure modes and effects analysis (FMEA).
• Strong understanding of optoelectronic devices and the impact of packaging on overall device reliability.
• General knowledge of common packaging processes used in the micro-electronic / photonics industry.

Responsibilities

• Develop and optimize processes used in the assembly of Polaris’ opto-electronic products.
• Design and implement advanced packaging workflows, specifically focusing on Flip Chip assembly and Thermo-Compression Bonding (TCB) for high-density interconnects.
• Lead the integration of 2.5D/3D packaging architectures to support next-generation silicon photonics Engines.
• Interact with suppliers, subcontractors, and contract manufacturers to ensure process scalability.
• Define and conduct Designs of Experiments (DOE) to optimize yield and performance.
• Generate Statements of Work (SOW) and detailed project plans for new process development activities.
• Responsible for improving, monitoring, and reporting manufacturing process health (yield, failure paretos,etc).

Skills

5+ years experience

Flip Chip packaging

Thermo-Compression Bonding

2.5D/3D packaging

DOE

FMEA

optoelectronic devices understanding

Education

Bachelor's degree in Electrical/Mechanical Engineering, Physics

Tools

JMP

Minitab

Job description

About Polaris Electro-Optics

Polaris Electro-Optics is a rapidly growing photonics company developing breakthrough optical interconnect

technology for data centers, AI, and high-performance computing. Their proprietary FenGlass™ platform integrates

ferroelectric nematic materials into silicon photonics, enabling faster, compact, and more energy-efficient

solutions. Located in San Diego and backed by substantial funding, Polaris is scaling to meet demand from

hyperscale customers and transceiver suppliers.

Role Overview

Polaris is seeking a hands-on Sr Process Engineer to develop and monitor advanced manufacturing processes. This

is a high-impact role supporting multiple prototype and product development efforts across engineering teams.

You’ll be collaborating closely with optics and electronics engineers to bring concepts to life. Ideal candidates

thrive in startup environments, manage multiple priorities with ease, and bring strong process development

manufacturing experience to the table.

Key Responsibilities

• Develop and optimize processes used in the assembly of Polaris’ opto-electronic products.
• Design and implement advanced packaging workflows, specifically focusing on Flip Chip assembly and Thermo-Compression Bonding (TCB) for high-density interconnects.
• Lead the integration of 2.5D/3D packaging architectures to support next-generation silicon photonics Engines.
• Interact with suppliers, subcontractors, and contract manufacturers to ensure process scalability.
• Define and conduct Designs of Experiments (DOE) to optimize yield and performance.
• Generate Statements of Work (SOW) and detailed project plans for new process development activities.
• Responsible for improving, monitoring, and reporting manufacturing process health (yield, failure paretos,etc).

Who You Are (Basic Qualifications)

• 5+ years of hands-on experience in manufacturing processes and process improvements.
• Deep technical expertise in Flip Chip packaging and Thermo-Compression Bonding (TCB).
• Proven understanding of 2.5D and 3D packaging technologies and their unique reliability challenges.
• Experience with statistical analysis methods (DOE, Gage R&R, etc.) and software (JMP, Minitab, etc.).
• Experience with failure modes and effects analysis (FMEA).
• Strong understanding of optoelectronic devices and the impact of packaging on overall device reliability.
• General knowledge of common packaging processes used in the micro-electronic / photonics industry.

Qualifications

• Bachelor’s degree in Electrical / Mechanical Engineering, Physics, or a related discipline.
• Comfortable in fast-paced, startup environments with shifting priorities.
• Excellent communication and collaboration skills.