Senior Principal Photonic Process Integration Engineer

Jobtailor

Fremont (CA)

On-site

USD 140,000 - 210,000

Full time

14 days+

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Job summary

Coherent in Fremont, CA is seeking a seasoned Process Engineer to act as the primary technical liaison with external foundries for silicon photonics, CMOS, and advanced packaging. You will drive process development, qualification, audits, and continuous improvement to ensure product readiness and high yield.

The role requires a PhD and 10+ years in semiconductor foundries and photonics, with expertise in DFx, advanced packaging, and CAPA.

Qualifications

  • PhD in Electrical Engineering, Physics, Materials Science, or related field.
  • 10+ years of experience working with semiconductor foundries and photonics processes.
  • Strong understanding of photonics foundry and back-end manufacturing processes.
  • Experience with qualification of photonic foundry process and PIC products.
  • Experience with advanced packaging.

Responsibilities

  • Serve as the primary technical liaison between Coherent and external silicon photonics, silicon CMOS, and advanced packaging foundry partners.
  • Coordinate and drive foundry engagements related to process development, process control, manufacturing readiness, and technology qualification.
  • Plan, coordinate, and participate in audits of external foundry and manufacturing partners to assess process controls and readiness.
  • Lead root-cause investigations and failure analysis with foundries, reliability teams, and product engineering.
  • Track, analyze, and resolve yield detractors through data analysis and corrective actions.
  • Partner with foundries to identify CIP initiatives to improve device performance and manufacturability.
  • Collaborate with PIC design teams to implement DFM, DFY, and process robustness improvements.
  • Develop process characterization plans and monitor key metrics across foundry platforms.
  • Analyze fabrication, test, and reliability data to identify trends and opportunities for improvement.
  • Support new product introductions, technology transfers, and foundry migrations.
  • Work with reliability, test engineering, and manufacturing teams to establish process control methodologies.
  • Participate in technical reviews and communicate project status, risks, and mitigations.
  • Drive CAPA actions from yield excursions or reliability concerns.
  • Evaluate foundry process control methodologies and CAPA systems.
  • Review ECNs, PCNs, and technology updates for impact on product performance and qualification.
  • Establish supplier performance metrics and quality requirements.
  • Maintain process integration documentation and manufacturing specifications.

Skills

Semiconductor foundries
Photonics processes
SPC & CAPA
ECN/PCN review
DFM/DFY
Advanced packaging

Education

PhD in Electrical Engineering, Physics, Materials Science

Job description

Responsibilities
  • Serve as the primary technical liaison between Coherent and external silicon photonics, silicon CMOS, and advanced packaging foundry partners.
  • Coordinate and drive foundry engagements related to process development, process control, manufacturing readiness, and technology qualification.
  • Plan, coordinate, and participate in technical and quality audits of external foundry and manufacturing partners to assess process controls, quality systems, manufacturing readiness, and continuous improvement initiatives.
  • Lead root-cause investigations and failure analysis activities in collaboration with foundries, internal reliability teams, and product engineering organizations.
  • Track, analyze, and resolve wafer-level, die-level, and module-level yield detractors through systematic data analysis and corrective action implementation.
  • Partner with foundries to identify, prioritize, and execute Continuous Improvement Program (CIP) initiatives that improve device performance, yield, reliability, and manufacturability.
  • Collaborate with PIC design teams to identify process sensitivities and implement Design-for-Manufacturing (DFM), Design-for-Yield (DFY), and process robustness improvements.
  • Develop process characterization plans and monitor key process metrics, process windows, and critical device parameters across multiple foundry platforms.
  • Analyze fabrication, test, and reliability data to identify process trends, excursions, and opportunities for improvement.
  • Support new product introductions, technology transfers, process qualifications, and foundry migrations.
  • Work closely with reliability, test engineering, and manufacturing teams to establish process control methodologies and monitor long‑term process stability.
  • Participate in technical reviews with internal stakeholders and external foundry partners and communicate project status, risks, and mitigation plans.
  • Drive corrective and preventive actions (CAPA) resulting from yield excursions, reliability concerns, or customer‑return investigations.
  • Evaluate foundry process control methodologies, Statistical Process Control (SPC) implementation, excursion management procedures, change control practices, and corrective/preventive action (CAPA) systems.
  • Review foundry process changes, engineering change notices (ECNs), process change notifications (PCNs), and technology updates to assess potential impacts on product performance, yield, reliability, and qualification status.
  • Establish and maintain supplier performance metrics, including yield, defect density, process capability, cycle time, on‑time delivery, and quality indicators.
  • Develop and maintain process integration documentation, manufacturing specifications, process control plans, and supplier quality requirements.
Requirements
  • PhD in Electrical Engineering, Physics, Materials Science, or related field
  • 10+ years of experience working with semiconductor foundries, photonics processes developments
  • Strong understanding of photonics foundry and back‑end manufacturing processes
  • Experience in qualification of photonic foundry process and PIC products
  • Experience with advanced packaging
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